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Specifications
Voltage Rating:
250V
Capacitance:
33pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G330J251NT
Model Number:
0805C0G330J251NT
Package:
0805
Key Attributes
Product Description
Product Description
Medium and High voltage MLCCs designed for coupling, wave filtering, and resonant applications in high voltage circuits. Suitable for switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal composition: Au/Ag-Ni-Sn
- Packing: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature Characteristic | C0G (0±30 PPM/°C), X7R (±15%), X5R (±15%) | |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:±0.1pF, C:±0.25pF, D:±0.5pF, F:±1%, G: ±2%, J: ±5%, K: ±10%, M: ±20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250V, 251=250V, 252=2500V | |
| Temperature Range | -55~+125°C | |
| Static Capacity (NPO) | ≤1000pF: 1MHz±10%, 1.0±0.2Vrms >1000pF: 1KHz±10%, 1.0±0.2Vrms | |
| Static Capacity (X7R/X7T/X7P) | ≤10uF: 1KHz±10%, 1.0±0.2Vrms >10uF: 120Hz±24, 0.5±0.1Vrms | |
| Dissipation Factor (DF) (NPO) | DF≤0.56 (Cr<5pF) DF≤1.5[(150/Cr)+7]×10-4 (5pF≤Cr<50pF) DF≤0.15% (50pF≤Cr) | Cr≤1000pF, 1±10%MHz, 1V±0.2rms Cr>1000pF, 1±10%KHz, 1V±0.2rms |
| Dissipation Factor (DF) (X7R/X7T/X7P) | See Note 1 | Cr≤10uF, 1±10%KHz, 1V±0.1rms Cr>10uF, 120±24Hz, 0.5V±0.1rms |
| Insulation Resistance (IR) (NPO) | IR≥50000MΩ, C≤10nF IR*Cr≥500S, C>10nF | Rated voltage, Time:60±5s, Humidity:≤75%, Temp:25±5°C, Current:≤50mA |
| Insulation Resistance (IR) (X7R/X7T/X7P) | IR≥10000MΩ, C≤25nF IR*Cr≥100S, C>25nF | Rated voltage, Time:60±5s, Humidity:≤75%, Temp:25±5°C, Current:≤50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Voltage Raising time:110S, Voltage maintaining time2S |
| Solderability | Soldering area≥90% | Pre-heating 80-120, 10-30s; Solder temp 245±5, Solder time 2±0.5s |
| Resistance to the heat of soldering | No damage, soldering area≥90% | Pre-heating 100-200, 10±2s; Solder temp 265±5, Solder time 5±1s |
| Electrostatic Capacity Change Rate (after Soldering) | NPO: ¦ΔC/C¦≤0.5% or ±0.5pF X7R: ¦ΔC/C¦≤15% X7T: -33% ≤ΔC/C≤22% X7P: ¦ΔC/C¦≤10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. |
| Flexural Strength | No damage | Base board: Al2O3 /PCB, PCB thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Electro static capacity change rate (Flexural) | ¦ΔC/C¦≤10% | Test it under the flexural status. |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 10±1S |
| Thermal Shock | NPO: ¦ΔC/C¦≤2.5% or 0.25pF X7R/X7P: ¦ΔC/C¦≤0.5% X7T: ¦ΔC/C¦≤10% | Pre-condition(X7R h characteristic):Upper limit temp 1hour, place 24±1 hours. Run 5 cycles. Test after place 24±2 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage Capacity Change Rate: NPO: ¦ΔC/C¦≤2% or 1pF X7R/X7T/X7P: ¦ΔC/C¦≤10% DF: ≤2 times initial standard IR: NPO: IR≥2500MΩ or IR*Cr≥25S X7R/X7T/X7P: IR≥1000MΩ or IR*Cr≥25S | Temp: 40±2°C, Humidity: 90~95%RH, Time: 500±+24 hours. Test after place 24±2 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage Capacity Change Rate: NPO: ¦ΔC/C¦≤2% or 1pF X7R/X7T/X7P: ¦ΔC/C¦≤20% DF: ≤2 X initial standard IR: NPO: IR≥4000MΩ or IR*Cr≥40S X7R/X7T/X7P: IR≥2000MΩ or IR*Cr≥50S | Temp: 125±3°C, Time: 1000±48 hours. Voltage: 100V≤V≤250V (2x Rated voltage), 250V<V<1KV (1.5x rated voltage), 1KV≤V (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. |
2509251626_AIDE-CAPACITOR-0805C0G330J251NT_C49326674.pdf
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