Product Overview
This specification outlines the details for Medium and High Voltage Multilayer Ceramic Capacitors (MLCCs). These capacitors are designed for applications in coupling, wave filtering, and resonance within high-voltage circuits. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes (Au/Ag-Ni-Sn terminal composition)
- Packing Options: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature Characteristic | NPO (0±30 PPM/°C), X7R (±15%), X5R (±15%) | |
| Nominal Electrostatic Capacity | Example: 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:±0.1pF, C:±0.25pF, D:±0.5pF, F:±1%, G: ±2%, J: ±5%, K: ±10%, M: ±20%, Z: +80%/-20% | |
| Rated Voltage (DC) | 250V, 251=250V, 252=2500V | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Temperature Range | -55~+125°C | |
| Static Capacity | NPO: ≤1000pF @ 1MHz±10%, 1.0±0.2Vrms; >1000pF @ 1KHz±10%, 1.0±0.2Vrms X7R/X7T/X7P: ≤10uF @ 1KHz±10%, 1.0±0.2Vrms; >10uF @ 120Hz±24, 0.5±0.1Vrms | |
| Dissipation Factor (DF) | NPO: DF≤0.56 (Cr<5pF), DF≤1.5[(150/Cr)+7]×10-4 (5pF≤Cr<50pF), DF≤0.15% (50pF≤Cr) X7R/X7T/X7P: See Note 1 | |
| Insulation Resistance (IR) | NPO: IR≥50000MΩ (C≤10nF), IR*Cr≥500S (C>10nF) X7R/X7T/X7P: IR≥10000MΩ (C≤25nF), IR*Cr≥100S (C>25nF) | Rated voltage, Time: 60±5s, Humidity: ≤75%, Temperature: 25±5°C, Current: ≤50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KV≤Ur≤2KV: 1.2 x rated voltage 2KV<Ur: 1.1 x rated voltage | Voltage Raising time: 1-10s, Voltage maintaining time: 2s |
| Solderability | Soldering area ≥90% | Pre-heating: 80-120°C (10-30s), Solder: Lead-free, Flux, Temp: 245±5°C, Time: 2±0.5s |
| Resistance to the heat of soldering | No damage, Soldering area ≥90% | Pre-heating: 100-200°C (10±2s), Solder Temp: 265±5°C (5±1s), Cleaning, Room temp (24±2h) |
| Flexural Strength | Electro static capacity change rate: &ΔC/C&≤10% | Base board: Al2O3 /PCB, PCB dim: 1.6mm thickness, 100mm length, 40mm width. Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 10±1s |
| Thermal Shock | NPO: &ΔC/C&≤2.5% or 0.25pF X7R/X7P: &ΔC/C&≤0.5% X7T: &ΔC/C&≤10% | Pre-condition (X7R): Upper limit temp 1hr, place 24±1h. 5 cycles. Test after 24±2h normal temp & humidity. |
| Temperature Moisture Exposure | Capacitance change rate: NPO &ΔC/C&≤2% or 1pF, X7R/X7T/X7P &ΔC/C&≤10% DF ≤2 times initial standard IR: NPO ≥2500MΩ or IR*Cr≥25S, X7R/X7T/X7P ≥1000MΩ or IR*Cr≥25S | Temperature: 40±2°C, Humidity: 90-95%RH, Time: 500±24 hours. Test after 24±2h normal temp & humidity. |
| High Temperature Exposure | Capacitance change rate: NPO &ΔC/C&≤2% or 1pF, X7R/X7T/X7P &ΔC/C&≤20% DF ≤2 X initial standard IR: NPO ≥4000MΩ or IR*Cr≥40S, X7R/X7T/X7P ≥2000MΩ or IR*Cr≥50S | Temperature: 125±3°C, Time: 1000±48 hours. Voltage: 100V≤V≤250V (2x Rated), 250V<V<1KV (1.5x Rated), 1KV≤V (1.2x Rated). Test after 48h normal pressure & temp. |
| PCB Flexural Strength | No crack and other defect | MLCC soldered on PCB, pressing direction as per photo. |
2509251626_AIDE-CAPACITOR-0805X5R106M350NT_C49326682.pdf
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