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quality Ceramic Capacitors AIDE CAPACITOR 0805X5R106M500NT Featuring Au Ag Ni Sn Terminals for Electrical Performance factory
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quality Ceramic Capacitors AIDE CAPACITOR 0805X5R106M500NT Featuring Au Ag Ni Sn Terminals for Electrical Performance factory
>
Specifications
Voltage Rating:
50V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0805X5R106M500NT
Model Number:
0805X5R106M500NT
Package:
0805
Key Attributes
Product Description

Product Overview

This specification details Medium and High Voltage Multilayer Ceramic Capacitors (MLCCs) designed for various high-voltage applications. These capacitors are suitable for coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn
  • Packing Options: Tape/Reel (T), Bag packing (P)

Technical Specifications

ItemSpecification/RequirementTesting Method
1. Temperature CharacteristicNPO: 0 30 PPM/
X7R: 15%
X5R: 15%
2. Nominal Electrostatic CapacityExamples: 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF
3. Tolerance of Electrostatic CapacityB: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
4. Rated Voltage (DC)Examples: 250 = 25V, 251 = 250V, 252 = 2500V
5. Temperature Range-55 ~ +125
6. Dissipation Factor (DF)NPO Characteristic: DF 0.56 (Cr < 5pF), DF 1.5[(150/Cr)+7]10 (5pF Cr < 50pF), DF 0.15% (50pF Cr)
X7R/X7T/X7P Characteristic: See Note 1
Refer to specification details
7. Insulation Resistance (IR)NPO Characteristic: IR 50000M (C 10nF), IR*Cr 500S (C > 10nF)
X7R/X7T/X7P Characteristic: IR 10000M (C 25nF), IR*Cr 100S (C > 25nF)
Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
8. Hi-pot (DC)Ur=100V: 2.5 x rated voltage
Ur=200V/250V: 2.0 x rated voltage
Ur=450/500/630V: 1.5 x rated voltage
1KV Ur 2KV: 1.2 x rated voltage
2KV < Ur: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time: 2S
9. SolderabilitySoldering area 90%Pre-heating temperature 80-120, time 10-30s, lead-free solder, flux. Soldering temperature 2455, Solder time 20.5s.
10. Resistance to the heat of solderingVisual-No damage, soldering area 90%Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
11. Electrostatic Capacity Change RateNPO Characteristic: |C/C| 0.5% or 0.5pF (larger reading)
X7R: |C/C| 15%
X7T: -33% C/C 22%
X7P: |C/C| 10%
Refer to testing method for specific conditions
12. Flexural StrengthNo damageBase board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
13. Terminal Bonding StrengthNo visual damageApplied Force: 5N, Duration: 101S
14. Thermal ShockNPO Characteristic: |C/C| 2.5% or 0.25pF (larger reading)
X7R/X7P Characteristic: |C/C| 0.5%
X7T Characteristic: |C/C| 10%
Pre-condition (X7R characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity.
15. Temperature Moisture ExposureNPO characteristic: |C/C| 2% or 1pF (larger reading)
X7R/X7T/X7P characteristic: |C/C| 10%
DF 2 times initial standard
IR NPO characteristic: IR 2500M or IR*Cr 25S (Lower reading)
X7R/X7T/X7P: IR 1000M or IR*Cr 25S (Lower reading)
Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity.
16. High Temperature ExposureNPO: |C/C| 2% or 1pF (larger reading)
X7R/X7T/X7P: |C/C| 20%
DF 2 x initial standard
IR NPO: IR 4000M or IR*Cr 40S (Lower reading)
X7R/X7T/X7P: IR 2000M or IR*Cr 50S (Lower reading)
Temperature 1253, Time 100048 hours. Voltage: 100V V 250V (2x Rated voltage), 250V < V < 1KV (1.5x rated voltage), 1KV V (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature.
17. PCB Flexural StrengthNo crack and other defectsMLCC soldered on PCB, pressing direction as per diagram.

Dimensions and Construction

Part Number CodeDimension (mm) L*WDimension (mm) TWB (mm)
0201 (0603)0.600.10 * 0.300.050.300.050.100.05
0402 (1005)1.000.15 * 0.500.150.500.100.200.10
0603 (1608)1.600.20 * 0.800.150.800.150.300.10
0805 (2012)2.000.20 * 1.250.200.800.200.500.20
1206 (3216)3.200.30 * 1.600.301.000.200.600.30
1210 (3225)3.200.30 * 2.500.302.700.800.30
1808 (4520)4.500.40 * 2.000.202.700.800.30
1812 (4532)4.500.40 * 3.200.303.500.800.30
1825 (4563)4.500.40 * 6.300.503.500.800.30
2220 (5750)5.700.50 * 5.000.503.501.000.40
2225 (5763)5.700.50 * 6.300.506.201.000.40

Taping Specifications

CodeTape Size (mm)ABCDEFGHJT
0805T1.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
1206T1.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
1210T2.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
1808T2.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
1812T3.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
1005Paper0.240.020.450.028.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.30 Below
0201Paper0.370.100.670.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
0402Paper0.650.101.150.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
0603Paper1.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
0805Paper1.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
1206Paper1.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max

2509251626_AIDE-CAPACITOR-0805X5R106M500NT_C49326683.pdf

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