Product Overview
This specification details Medium and High Voltage Multilayer Ceramic Capacitors (MLCCs) designed for various high-voltage applications. These capacitors are suitable for coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They are available in a range of sizes, temperature characteristics, and electrical specifications to meet diverse industry needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature Characteristic | C0G (0±30 PPM/°C), X7R (±15%), X5R (±15%) | - |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | - |
| Tolerance of Electrostatic Capacity | B:±0.1pF, C:±0.25pF, D:±0.5pF, F:±1%, G: ±2%, J: ±5%, K: ±10%, M: ±20%, Z: +80%/-20% | - |
| Rated Voltage (DC) | 250V, 251=250V, 252=2500V | - |
| Operating Temperature Range | -55~+125°C | - |
| Static Capacity | NPO: 1MHz±10%, 1.0±0.2Vrms (for ≤1000pF); 1KHz±10%, 1.0±0.2Vrms (for >1000pF) X7R/X7T/X7P: 1KHz±10%, 1.0±0.2Vrms (for ≤10uF); 120Hz±24, 0.5±0.1Vrms (for >10uF) | Frequency, Voltage |
| Dissipation Factor (DF) | NPO: DF≤0.56 (Cr<5pF), DF≤1.5[(150/Cr)+7]×10-4 (5pF≤Cr<50pF), DF≤0.15% (50pF≤Cr) X7R/X7T/X7P: See Note 1 | Frequency, Voltage |
| Insulation Resistance (IR) | NPO: IR≥50000MΩ (C≤10nF), IR*Cr≥500S (C>10nF) X7R/X7T/X7P: IR≥10000MΩ (C≤25nF), IR*Cr≥100S (C>25nF) | Rated voltage, Time, Humidity, Temperature, Current |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KV≤Ur≤2KV: 1.2 x rated voltage; 2KV<Ur: 1.1 x rated voltage | Voltage Raising time, Voltage maintaining time |
| Solderability | Soldering area ≥90% | Pre-heating temperature, time, lead free solder, flux, Soldering temperature, Solder time |
| Resistance to the heat of soldering | No damage, soldering area ≥90% | Pre-heating temperature, time, soldering temperature, Soldering time, Cleaning with solvent, Room temperature, time |
| Electrostatic Capacity Change Rate | NPO: |ΔC/C| ≤0.5% or ±0.5pF; X7R: |ΔC/C| ≤15%; X7T: -33% ≤ ΔC/C ≤22%; X7P: |ΔC/C| ≤10% | - |
| Flexural Strength | No damage | Base board, PCB dimension, Flexural depth, Bend speed, Test under flexural status |
| Terminal Bonding Strength | No visual damage | Applied Force, Duration |
| Thermal Shock | NPO: |ΔC/C| ≤2.5% or 0.25pF; X7R/X7P: |ΔC/C| ≤0.5%; X7T: |ΔC/C| ≤10% | Pre-condition, Run 5 cycles, Test after placing |
| Temperature Moisture Exposure | Visual: No visual damage; Capacity Change Rate: NPO: |ΔC/C| ≤2% or 1pF; X7R/X7T/X7P: |ΔC/C| ≤10%; DF ≤2 times initial standard; IR: NPO: IR≥2500MΩ or IR*Cr≥25S; X7R/X7T/X7P: IR≥1000MΩ or IR*Cr≥25S | Temperature, Humidity, Time, Electrostatic capacitance change rate, DF, IR |
| High Temperature Exposure | Visual: No visual damage; Capacity Change Rate: NPO: |ΔC/C| ≤2% or 1pF; X7R/X7T/X7P: |ΔC/C| ≤20%; DF ≤2 X initial standard; IR: NPO: IR≥4000MΩ or IR*Cr≥40S; X7R/X7T/X7P: IR≥2000MΩ or IR*Cr≥50S | Temperature, Time, Voltage, Electrostatic capacitance change rate, DF, IR |
| PCB Flexural Strength | No crack and other defect | IR, Soldering MLCC on PCB, Pressing direction |
2509251626_AIDE-CAPACITOR-0805X7R104J101NT_C49326700.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible