Product Overview

This specification outlines the details for Medium and High Voltage MLCCs designed for various high-voltage circuit applications. These components are suitable for coupling, wave filtering, and resonant functions in power supplies, chargers, communication interfaces, and lighting solutions.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
Packing Options: Tape/Reel (T), Bag packing (PE) (P)

Technical Specifications

Item	Specification/Requirement	Testing Method
1. Temperature Characteristic	C0G (030 PPM/), X7R (15%), X5R (15%)
2. Nominal Electrostatic Capacity	8R0=8.0pF, 100=10pF, 101=100pF
3. Tolerance of Electrostatic Capacity	B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
4. Rated Voltage (DC)	250V (Code 250), 250V (Code 251), 2500V (Code 252)
5. Temperature Range	-55~+125
6. Static Capacity (NPO)	1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms
7. Static Capacity (X7R/X7T/X7P)	10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
8. Dissipation Factor (DF) - NPO	DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Cr1000pF: 110%MHz, 1V0.2rms; Cr1000pF: 110%KHz, 1V0.2Vrms
9. Dissipation Factor (DF) - X7R/X7T/X7P	See Note 1. Cr10uF: 110%KHz, 1V0.1rms; Cr10uF: 12024Hz, 0.5V0.1Vrms
10. Insulation Resistance (IR) - NPO	IR50000M (C10nF); IR*Cr500S (C10nF). Testing condition: Rated voltage, 605s, 75%RH, 255, 50mA
11. Insulation Resistance (IR) - X7R/X7T/X7P	IR10000M (C25nF); IR*Cr100S (C25nF)
12. Hi-pot (DC)	Ur=100V: 2.5x rated voltage; Ur=200V/250V: 2.0x rated voltage; Ur=450/500/630V: 1.5x rated voltage; 1KVUr2KV: 1.2x rated voltage; 2KVUr: 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
13. Solderability	Soldering area90%. Pre-heating: 80-120, 10-30s; Solder: Lead free, flux; Temp: 2455, Time: 20.5s	Visual inspection, Soldering area measurement
14. Resistance to the heat of soldering	Visual-No damage, soldering area90%. Pre-heating: 100-200, 102s; Temp: 2655, Time: 51s. Cleaning with solvent. Room temperature, 242 hours.	Visual inspection
15. Electrostatic Capacity Change Rate (Post-Soldering)	NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10%. DF & IR refer to NO#4 & NO#5.
16. Flexural Strength	No damage. Base board: Al2O3/PCB. PCB dimension: 1.6mm thickness, 100mm length, 40mm width. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: 10%.	Visual inspection
17. Terminal Bonding Strength	No visual damage. Applied Force: 5N, Duration: 101S	Visual inspection
18. Thermal Shock	NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10%. Pre-condition (X7R): Upper limit temp 1hr, 241 hrs dwell. 5 cycles. Test after 242 hrs at normal temp & humidity.	Visual inspection, Capacity change
19. Temperature Moisture Exposure	Visual-No damage. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change: NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF 2x initial. IR: NPO: 2500M or IRCr25S; X7R/X7T/X7P: 1000M or IRCr25S.	Visual inspection, Capacity change, DF, IR
20. High Temperature Exposure	Visual-No damage. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated), 250VV1KV (1.5x Rated), 1KVV (1.2x Rated). Capacity change: NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF 2x initial. IR: NPO: 4000M or IRCr40S; X7R/X7T/X7P: 2000M or IRCr50S.	Visual inspection, Capacity change, DF, IR
21. PCB Flexural Strength	No crack and other defect. IR measurement after soldering MLCC on PCB and pressing.	Visual inspection, IR measurement

2509251626_AIDE-CAPACITOR-0805X7R273K500NT_C49326716.pdf

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