Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, with options for different voltage ratings and tolerances.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC). | |
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa |
| Part Number Description | Example: 1812 X7R 684 M 251 N T 1. Dimension Code, 2. Temperature Characteristic, 3. Nominal Electrostatic Capacity, 4. Tolerance of Electrostatic Capacity, 5. Rated Voltage (DC), 6. Terminal Composition, 7. Packing. | |
| Dimension Codes (L*W) | Inch: 0.02*0.01, 0.04*0.02, 0.06*0.03, 0.08*0.05, 0.12*0.06, 0.12*0.10, 0.18*0.08, 0.18*0.12, 0.18*0.25, 0.22*0.11, 0.22*0.25 | mm: 0.50*0.25, 1.00*0.50, 1.60*0.80, 2.00*1.25, 3.20*1.60, 3.20*2.50, 4.50*2.00, 4.50*3.20, 4.50*6.30, 5.70*2.8, 5.70*6.30 |
| Specific Dimensions (mm) | Part Number | L | W | T | WB 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Testing Specifications | Item | Specification/Requirement | Testing Method 1. Temperature | -55~+125 | Naked eye (Visual inspection) 2. Visual/Dimension | 1,No Damage 2,Dimension meet Spec | Digital calliper 3. Static Capacity | Meet standard specification and tolerance | As per NPO/X7R characteristics (detailed frequencies/voltages provided) 4. Dissipation Factor (DF) | See Note 1 for X7R/X7T/X7P | As per NPO/X7R characteristics (detailed frequencies/voltages provided) 5. IR Insulation Resistance | NPO: 50000M, X7R/X7T/X7P: 10000M | Rated voltage, Time: 605s, Humidity: 75%, Temp: 255 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,...,2.5 x rated voltage; Ur=200V/250V,...,2.0 x rated voltage; Ur=450/500/630V,...,1.5 x rated voltage; 1KVUr2KV,...,1.2 x rated voltage; 2KVUr,...,1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S 7. Solderability | Soldering area90% | Pre-heating 80-120, time 10-30s, lead free solder, flux. Soldering temp 2455, Time 20.5s. 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating 100-200, time 102s, soldering temp 2655, time 51s. 9. Flexural Strength | No damage | Base board: Al2O3 /PCB. Test under flexural status. Electrostatic capacity change rate C/C10% 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S 11. Thermal Shock | Visual No damage | 5 cycles, test after 242 hours at normal temp & humidity. 12. Temperature Moisture Exposure | Visual No damage | Temp 402, Humidity 90~95%RH, time 50024 hours. 13. High Temperature Exposure | Visual No damage | Temp 1253, Time 100048 hours. Voltage dependent on rating. 14. PCB Flexural Strength | No crack and other defect | IR measurement after soldering MLCC on PCB. | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Embossed Plastic Taping Dimensions | Code | Tape size A | B | C | D | E | F | G | H | J 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | |
| Paper Tape Reel Packing Dimensions | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions | Unit: mm 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm), 3000 (T1.35mm) 1206 | | 2000 (T1.60mm), 3000 (T1.60mm) 1210 | | 2000 1808 | | 1000 (T1.85mm) 1812 | | 1000 (T1.85mm) 1812 | | 800 (Plastic T/R), 500 (Plastic T/R) | |
| Recommended Soldering Method | Size | Temperature Characteristics | Capacitance | Soldering Method 1005 | NPO / R | X7R/X5R/X7S/X6S / R 0201 | NPO / R | X7R/X5R/X7S/X6S / R | Y5V / R 0402 | NPO / R | X7R/X5R/X7S/X6S / R | Y5V / R 0603 | NPO / R/W | X7R/X5R/X7S/X6S / C1uf R, C1uf R/W | Y5V / C1uf R, C1uf R/W 0805 | NPO / R/W | X7R/X5R/X7S/X6S / C4.7uf R, C4.7uf R/W | Y5V / C1uf R, C1uf R/W 1206 | NPO / R/W | X7R/X5R/X7S/X6S / C10uf R, C10uf R/W | Y5V / C10uf R, C10uf R/W 1210 | NPO / R | X7R/X5R/X7S/X6S / R | Y5V / R Soldering method: RReflow Soldering, WWave Soldering | |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions.
- Soldering Profile: Follow the provided temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and surface temperature of chips 150 during preheating.
2509251626_AIDE-CAPACITOR-1206X5R107K6R3NT_C49326743.pdf
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