quality MLCC AIDE CAPACITOR 1206X5R476M6R3NT designed for coupling wave filtering and resonant applications in power circuits factory

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Specifications

Voltage Rating:

6.3V

Capacitance:

47uF

Temperature Coefficient:

X5R

Tolerance:

±20%

Mfr. Part #:

1206X5R476M6R3NT

Model Number:

1206X5R476M6R3NT

Package:

1206

Key Attributes

Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
Compliance: ROHS/REACH compliant

Technical Specifications

Application Field

Coupling, wave filtering, resonant in high voltage circuits, such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).

Testing Conditions

Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa

Part Number Description

Example: 1812 X7R 684 M 251 N T

Dimension Codes and Sizes

Code	L*W (inch)	L*W (mm)
0201	0.02*0.01	0.50*0.25
0402	0.04*0.02	1.00*0.50
0603	0.06*0.03	1.60*0.80
0805	0.08*0.05	2.00*1.25
1206	0.12*0.06	3.20*1.60
1210	0.12*0.10	3.20*2.50
1808	0.18*0.08	4.50*2.00
1812	0.18*0.12	4.50*3.20
1825	0.18*0.25	4.50*6.30
2211	0.22*0.11	5.70*2.8
2225	0.22*0.25	5.70*6.30

Temperature Characteristics

C0G: 030 PPM/
X7R: 15%
X5R: 15%

Nominal Electrostatic Capacity

8R0: 8.0 pF
100: 10 pF
101: 100 pF

Tolerance of Electrostatic Capacity

B: 0.1pF
C: 0.25pF
D: 0.5pF
F: 1%
G: 2%
J: 5%
K: 10%
M: 20%
Z: +80%/-20%

Rated Voltage (DC)

250: 25 V
251: 250 V
252: 2500 V

Packing

T: Tape/Reel
P: Bag packing (PE)

Construction

Ceramic dielectric
Inner electrode
Outer electrode
Nickel layer
Tin layer

Dimensions (mm)

Part Number	Dimension (mm) L	Dimension (mm) W	Dimension (mm) T	Dimension (mm) WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40

Specification and Testing Method

No	Item	Specification/Requirement	Testing method
1	Temperature	-55~+125
2	Visual/ Dimension	1, No Damage 2, Dimension meet Spec	Naked eye (Visual inspection), Digital calliper
3	Static capacity	Meet standard specification and tolerance	NPO characteristic: Capacity Frequency Voltage: 1000pF 1MHz10% 1.00.2Vrms; 1000 pF 1KHz10% 1.00.2Vrms X7R/X7T/X7P characteristic: Capacity Frequency Voltage: 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms
4	Dissipation factor (DF)	NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1 Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5	IR Insulation Resistance	NPO Characteristic: IR50000M,C10nF; IRCr500S,C10nF Testing condition: Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA X7R/X7T/X7P Characteristic: IR10000M,C25nF; IRCr100S,C25nF
6	Hi-pot (DC)	No dielectric breakdown or damage Ur=100V, ... 2.5 x rated voltage Ur=200V/250V, .... 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, ....... 1.2 x rated voltage 2KVUr, ............... 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time2S
7	Solderability	soldering area90%	Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s.
8	Resistance to the heat of soldering	Visual-No damage, soldering area90%	Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9	Flexural strength	No damage	Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm Length: 100mm Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status.
10	Terminal bonding strength	No visual damage	Applied Force: 5N Duration: 101S
11	Thermal shock	NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic: C/C10% Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12	Temperature moisture exposure	Visual: No visual damage Temperature 402 Humidity 90~95%RH time 500+24 hours Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard IR: NPO characteristic: IR2500M or IRCr25S (Lower reading); X7R/X7T/X7P: IR1000M or IRCr25S (Lower reading)	Test it after place 242 hours normal temp & humidity.
13	High temperature exposure	Visual: No visual damage Temperature 1253 Time 100048 hours Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IRCr40S (Lower reading); X7R/X7T/X7P: IR2000M or IRCr50S (Lower reading)	Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature.
14	PCB flexural strength	No crack and other defect	Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2.

Embossed Plastic Taping

Code	Tape size A	B	C	D	E	F	G	H	J	T
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max

Paper Tape Reel Packing

Code	Paper size W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.24 0.02	0.45 0.02	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.30 Below
0201	0.37 0.10	0.67 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below
0402	0.65 0.10	1.15 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below

Code	Paper size A	B	C	D	E	F	G	H	J	T
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

Reel Dimensions

Unit: mm	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max

Taping Specification

Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Packing Quantity

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000
0805	4000	3000 (T1.35mm)
1206		3000 (T1.35mm)
1210		2000 (T1.60mm)
1808		3000 (T1.60mm)
1812		2000
1812		1000 (T1.85mm)
		1000 (T1.85mm)
		800
		500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe conditions beyond specified ratings. Following precautions for safety and application notes should be considered. Contact engineering or factory for handling precautions.

Soldering Profile: Avoid cracks due to sudden temperature change. Follow the recommended temperature profile.
Manual Soldering: Risk of thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature.
Optimum Solder Amount for Reflow Soldering
Recommended Soldering amounts

Recommended Soldering Method

Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R
			C1uf	R/W
	Y5V	/	C1uf	R
			C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R
			C4.7uf	R/W
	Y5V	/	C1uf	R
			C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R
			C10uf	R/W
	Y5V	/	C10uf	R
			C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.

2509251626_AIDE-CAPACITOR-1206X5R476M6R3NT_C49326755.pdf

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