Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They are suitable for medium and high voltage circuits and are available in various sizes and dielectric characteristics.
Product Attributes
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | N/A |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | N/A |
| Dimension Codes & Sizes | Code | L*W (inch) | L*W (mm) 0201 | 0.02*0.01 | 0.50*0.25 0402 | 0.04*0.02 | 1.00*0.50 0603 | 0.06*0.03 | 1.60*0.80 0805 | 0.08*0.05 | 2.00*1.25 1206 | 0.12*0.06 | 3.20*1.60 1210 | 0.12*0.10 | 3.20*2.50 1808 | 0.18*0.08 | 4.50*2.00 1812 | 0.18*0.12 | 4.50*3.20 1825 | 0.18*0.25 | 4.50*6.30 2211 | 0.22*0.11 | 5.70*2.8 2225 | 0.22*0.25 | 5.70*6.30 | N/A |
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Nominal Electrostatic Capacity (pF) | 8R0=8.0, 100=10, 101=100 | N/A |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | N/A |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | N/A |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A |
| Packing Codes | T: Tape/Reel, P: Bag packing (PE) | N/A |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimensions (mm) | Part number | Dimension (mm) Code | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | | Digital caliper |
| Temperature Characteristic | -55~+125 | N/A |
| Static Capacity | Characteristic | Frequency | Voltage NPO | 1000pF: 1MHz10%, 1.00.2Vrms | NPO | >1000pF: 1KHz10%, 1.00.2Vrms | X7R/X7T/X7P | 10uF: 1KHz10%, 1.00.2Vrms | X7R/X7T/X7P | >10uF: 120Hz24, 0.50.1Vrms | N/A |
| Dissipation Factor (DF) | Characteristic | Specification | Frequency | Voltage NPO | DF0.56, Cr5 pF | 1MHz10% | 1V0.2rms NPO | DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) | 1MHz10% | 1V0.2rms NPO | DF0.15%, (50pFCr) | 1MHz10% | 1V0.2rms NPO | Cr1000pF | 1MHz10% | 1V0.2rms NPO | Cr1000pF | 1KHz10% | 1V0.2rms X7R/X7T/X7P | Cr10uF | 1KHz10% | 1V0.1rms X7R/X7T/X7P | Cr10uF | 120Hz24 | 0.5V0.1rms | N/A |
| Insulation Resistance (IR) | Characteristic | Specification NPO | IR50000M, C10nF | NPO | IR*Cr500S, C10nF | X7R/X7T/X7P | IR10000M, C25nF | X7R/X7T/X7P | IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Rated Voltage (Ur) | Test Voltage Ur=100V | 2.5 x rated voltage Ur=200V/250V | 2.0 x rated voltage Ur=450/500/630V | 1.5 x rated voltage 1KVUr2KV | 1.2 x rated voltage 2KVUr | 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90%, No Damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | Characteristic | Change Rate NPO | 0.5% or 0.5pF (larger reading) X7R | 15% X7T | -33% C/C22% X7P | 10% | N/A |
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | Characteristic | Capacity Change Rate NPO | 2.5% or 0.25pF (larger reading) X7R/X7P | 0.5% X7T | 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Characteristic | Capacity Change Rate | DF | IR NPO | 2% or 1pF (larger reading) | 2 times initial standard | IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P | 10% | 2 times initial standard | IR1000M or IR*Cr25S (Lower reading) | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after place 242 hours normal temp & humidity. |
| High Temperature Exposure | Characteristic | Capacity Change Rate | DF | IR NPO | 2% or 1pF (larger reading) | 2 X initial standard | IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P | 20% | 2 X initial standard | IR2000M or IR*Cr50S (Lower reading) | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C 0805(2012) 1.2 4 1.65 1206(3216) 2.2 5 2 1210(3225) 2.2 5 2.9 1812(4532) 3.5 7 3.7 2220(5750) 4.5 8 5.6 |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 4.0 Max | N/A |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | N/A |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size A | B | C | D | E | F | G | H | J | T 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | N/A |
| Reel Dimensions (mm) | Unit | A | B | C | D | E | F | G 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | N/A |
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | N/A |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) / 3000 (T1.35mm) 1206 | | 2000 (T1.60mm) / 3000 (T1.60mm) 1210 | | 2000 1808 | | 1000 (T1.85mm) 1812 | | 1000 (T1.85mm) 1812 | | 800 / 500 | N/A |
| Soldering Method Recommendation | Size | Capacitance | Soldering Method 1005 | All | R 0201 | All | R 0402 | All | R 0603 | NPO | R/W 0603 | X7R/X5R/X7S/X6S | C1uf: R; C1uf: R/W 0603 | Y5V | C1uf: R; C1uf: R/W 0805 | NPO | R/W 0805 | X7R/X5R/X7S/X6S | C4.7uf: R; C4.7uf: R/W 0805 | Y5V | C1uf: R; C1uf: R/W 1206 | NPO | R/W 1206 | X7R/X5R/X7S/X6S | C10uf: R; C10uf: R/W 1206 | Y5V | C10uf: R; C10uf: R/W 1210 | NPO | R 1210 | X7R/X5R/X7S/X6S | R 1210 | Y5V | R Soldering method: RReflow Soldering, WWave Soldering | N/A |
2509251626_AIDE-CAPACITOR-1206X7R223K101NT_C49326772.pdf
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