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Specifications
Voltage Rating:
50V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R224K500NT
Model Number:
1206X7R224K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes (Au/Ag-Ni-Sn terminal composition)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | High voltage circuits: Coupling, wave filtering, resonant applications. | |
| Examples: Switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, energy saving lamps. | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Capacitance Testing Pre-heating | 150 for 1 hour, then 48 hours under normal pressure & temperature. | |
| Part Number Description | Structure | Dimension Code | Temp. Characteristic | Nominal Capacity | Tolerance | Rated Voltage | Terminal Composition | Packing |
| Example | 1812 X7R 684 M 251 N T | |
| Dimension Codes (L*W) | Inch | 0.02*0.01 (0201), 0.04*0.02 (0402), 0.06*0.03 (0603), 0.08*0.05 (0805), 0.12*0.06 (1206), 0.12*0.10 (1210), 0.18*0.08 (1808), 0.18*0.12 (1812), 0.18*0.25 (1825), 0.22*0.11 (2211), 0.22*0.25 (2225) |
| Dimension Codes (L*W) | MM | 0.50*0.25 (0201), 1.00*0.50 (0402), 1.60*0.80 (0603), 2.00*1.25 (0805), 3.20*1.60 (1206), 3.20*2.50 (1210), 4.50*2.00 (1808), 4.50*3.20 (1812), 4.50*6.30 (1825), 5.70*2.8 (2211), 5.70*6.30 (2225) |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) |
| Nominal Electrostatic Capacity | Format | 8R0=8.0, 100=10, 101=100 (pF) |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Rated Voltage (DC) | Format | 250=25V, 251=250V, 252=2500V |
| Terminal Composition | Layers (Inside Out) | Au/Ag-Ni-Sn |
| Packing | Code | T (Tape/Reel), P (Bag packing) |
| Construction | Item | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer |
| Dimensions (mm) | See Page 2 for detailed dimensions (L, W, T, WB) for each size code (e.g., 0603, 1005, 1608, etc.). | |
| Specification and Testing Method | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimensions meet spec. Tested by naked eye and digital caliper. | |
| Static Capacity | NPO Characteristic | Frequency: 1MHz10% (1000pF), 1KHz10% (>1000pF). Voltage: 1.00.2Vrms (1000pF), 1.00.2Vrms (>1000pF). |
| Static Capacity | X7R/X7T/X7P Characteristic | Frequency: 1KHz10% (10uF), 120Hz24 ( >10uF). Voltage: 1.00.2Vrms (10uF), 0.50.1Vrms (>10uF). |
| Dissipation Factor (DF) | NPO Characteristic | DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Frequency: 110%MHz (Cr1000pF), 110%KHz (Cr>1000pF). Voltage: 1V0.2rms. |
| Dissipation Factor (DF) | X7R/X7T/X7P Characteristic | See Note 1. Frequency: 110%KHz (Cr10uF), 12024Hz (Cr>10uF). Voltage: 1V0.1rms (Cr10uF), 0.5V0.1rms (Cr>10uF). |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M (C10nF), IR*Cr500S (C>10nF). Testing: Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA. |
| Insulation Resistance (IR) | X7R/X7T/X7P Characteristic | IR10000M (C25nF), IR*Cr100S (C>25nF). |
| Hi-pot (DC) | Breakdown Voltage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 1-10S, Maintaining time: 2S. |
| Solderability | Specification | Soldering area 90%. Tested with lead-free solder, flux. Pre-heating: 80-120 (10-30s). Soldering: 2455 (20.5s). |
| Resistance to Heat of Soldering | Specification | No damage, soldering area 90%. Pre-heating: 100-200 (102s). Soldering: 2655 (51s). Cleaning with solvent. Room temp, 242 hours. |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) |
| Electrostatic Capacity Change Rate | X7R | C/C15% |
| Electrostatic Capacity Change Rate | X7T | -33% C/C22% |
| Electrostatic Capacity Change Rate | X7P | C/C10% |
| Flexural Strength | Specification | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate C/C10% under flexural status. |
| Terminal Bonding Strength | Specification | No visual damage. Applied Force: 5N, Duration: 101S. |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading). |
| Thermal Shock | X7R/X7P Characteristic | C/C0.5% |
| Thermal Shock | X7T Characteristic | C/C10% |
| Temperature Moisture Exposure | Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. |
| Temperature Moisture Exposure | DF | 2 times initial standard. |
| Temperature Moisture Exposure | IR | NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). |
| High Temperature Exposure | Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. |
| High Temperature Exposure | DF | 2 X initial standard. |
| High Temperature Exposure | IR | NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). |
| PCB Flexural Strength | Specification | No crack and other defect. IR tested after soldering MLCC on PCB. See Page 7 for dimensions (A, B, C) for various sizes. |
| Embossed Plastic Taping Dimensions | Tapesize | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for sizes 0805 to 1812. |
| Paper Tape Reel Packing Dimensions | Papersize | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402. |
| Paper Tape Reel Packing Dimensions | Papersize | See Page 9 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for sizes 0603, 0805, 1206. |
| Reel Dimensions | Unit: mm | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. |
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1206: Not specified. |
| Packing Quantity | Plastic T/R (Pcs) | 0805: 3000 (T1.35mm), 1206: 3000 (T1.35mm) / 2000 (T>1.35mm), 1210: 3000 (T1.60mm) / 2000 (T>1.60mm), 1808: 1000, 1812: 1000 (T1.85mm) / 800 (T>1.85mm), 1812: 500. |
| Recommended Soldering Method | Size/Characteristics | See Page 13 for detailed recommendations for sizes 1005 to 1210 and characteristics NPO, X7R/X5R/X7S/X6S, Y5V. RReflow Soldering, WWave Soldering. |
| Soldering Temperature Profile | Preheating | Temperature difference between soldering temperature and surface temperature of chips 150. |
2509251626_AIDE-CAPACITOR-1206X7R224K500NT_C49326774.pdf
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