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Specifications
Voltage Rating:
50V
Capacitance:
2.2uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R225K500NT
Model Number:
1206X7R225K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified electrical and mechanical conditions.
Product Attributes
- Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | ||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | ||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) | ||||||||
| 2. Temperature Characteristic | C0G, X7R, X5R | PPM/ or % | ||||||||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | pF | ||||||||
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | % or pF | ||||||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | V | ||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | N/A | ||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | N/A | ||||||||
| Construction | ||||||||||
| 1. Ceramic dielectric | N/A | N/A | ||||||||
| 2. Inner electrode | N/A | N/A | ||||||||
| 3. Outer electrode | N/A | N/A | ||||||||
| 4. Nickle layer | N/A | N/A | ||||||||
| 5. Tin layer | N/A | N/A | ||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| Temperature | -55~+125 | N/A | ||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | ||||||||
| Static Capacity | Meet standard specification and tolerance | See detailed specification in source | ||||||||
| Dissipation Factor (DF) | See detailed specification in source | See detailed specification in source | ||||||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage varies based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| Electrostatic capacity change rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C 22% X7P: 10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||||||||
| Flexural strength | No damage. Electro static capacity change rate: 10% | Base board: Al2O3 /PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| Thermal shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | 5 cycles, test after 242 hours normal temp & humidity. | ||||||||
| Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr25S, X7R/X7T/X7P 1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | ||||||||
| High temperature exposure | Visual: No visual damage. Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr40S, X7R/X7T/X7P 2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage varies based on rated voltage. Test after 48 hours under normal pressure & temperature. | ||||||||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on photo. | ||||||||
| Embossed Plastic Taping Dimensions (unit: mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (unit: mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Papersize A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Paper Taping Reel type, Embossed Taping | ||||||||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T>1.60mm) | ||||||||
| 1210 | - | 3000 (T1.85mm), 1000 (T>1.85mm) | ||||||||
| 1808 | - | 800 | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| MLCCs may fail in short or open circuit mode under severe electrical or mechanical stress beyond specified ratings. Follow soldering profiles and handling precautions to avoid cracks and damage. Direct contact with hot soldering iron tip on ceramic body should be avoided. | ||||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Capacitance | Soldering Method | |||||||
| 1005 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| 0201 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| 0402 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| 0603 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| Y5V | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C4.7uf | R | ||||||||
| C4.7uf | R/W | |||||||||
| Y5V | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C10uf | R | ||||||||
| C10uf | R/W | |||||||||
| Y5V | C10uf | R | ||||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| Soldering Temperature Profile | ||||||||||
| Preheating: Keep temperature difference between soldering temperature and surface temperature of chips 150. | ||||||||||
2509251626_AIDE-CAPACITOR-1206X7R225K500NT_C49326777.pdf
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