Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications including coupling, wave filtering, and resonant circuits. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics (C0G, X7R, X5R) with a wide range of capacitance, tolerance, and voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets RoHS standard
- REACH Compliance: Meets REACH standard
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | High voltage circuits: Coupling, wave filtering, resonant. Suitable for switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, energy saving lamps. (Medium and High voltage MLCC). | |
| Testing Conditions: - Normal Condition: Temperature 15~35, Humidity 45~75%RH, Atmosphere 86~106kPa - Relative Condition: Temperature 252, Humidity 60~70%RH, Atmosphere 86~106kPa | ||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | |
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| Construction | Item | Description |
| 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | N/A | |
| Dimensions (mm) | Part number | L W T WB |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |
| Specifications and Testing Methods | 1. Temperature | -55~+125 |
| 2. Visual/Dimension | No Damage, Dimension meet Spec | |
| 3. Static Capacity | Meets standard specification and tolerance. (NPO, X7R/X7T/X7P characteristics detailed in source) | |
| 4. Dissipation Factor (DF) | Detailed specifications for NPO and X7R/X7T/X7P characteristics provided in source. | |
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | |
| 6. Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur). (e.g., Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage). Voltage Raising time: 110S, Voltage maintaining time: 2S. | |
| Reliability Tests | 7. Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 9. Flexural Strength | No damage. Electro static capacity change rate |C/C| 10%. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |
| Environmental Tests | 11. Thermal Shock | NPO Characteristic: |C/C| 2.5% or 0.25pF. X7R/X7P characteristic: |C/C| 0.5%. X7T characteristic: |C/C| 10%. Run 5 cycles. Test after 242 hours at normal temp & humidity. |
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: |C/C| 2% or 1pF. X7R/X7T/X7P: |C/C| 10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Test at 402, 90~95%RH for 50024 hours. | |
| 13. High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: |C/C| 2% or 1pF. X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Test at 1253 for 100048 hours with specified voltages. | |
| 14. PCB Flexural Strength | No crack and other defect. IR measurement after soldering MLCC on PCB. | |
| Packing Quantity | 7'' Reel (Pcs): 4000 (0603, 0805), 3000 (1206, 1210), 2000 (1808, 1812), 1000 (1812+), 800 (2220), 500 (2225). Plastic T/R (Pcs): Varies by thickness and size. | |
| Soldering Methods | RReflow Soldering, WWave Soldering. Recommended methods vary by size, temperature characteristic, rated voltage, and capacitance. (Detailed in source) | |
Note: Detailed specifications for Dissipation Factor (DF) and specific test conditions for various characteristics are available in the original document.
2509251626_AIDE-CAPACITOR-1206X7R332K500NT_C49326781.pdf
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