Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
Part Number Description Example: 1812 X7R 684 M 251 N T
| Item | Description |
|---|---|
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) |
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) |
| 7. Packing | T Tape/Reel, P Bag packing (PE) |
Construction
| Item | Description |
|---|---|
| 1 | Ceramic dielectric |
| 2 | Inner electrode |
| 3 | Outer electrode |
| 4 | Nickel layer |
| 5 | Tin layer |
Dimensions (mm)
| Part Number | Dimension (mm) | L | W | T | WB |
|---|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Specification and Testing Method
| No. | Item | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1 | Temperature | -55~+125 | |
| 2 | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3 | Static Capacity | Meet standard specification and tolerance |
|
| 4 | Dissipation Factor (DF) |
| |
| 5 | IR Insulation Resistance |
| Testing condition : Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA |
| 6 | Hi-pot (DC) |
| Voltage Raising time:110S, Voltage maintaining time2S |
| 7 | Solderability | soldering area90% | Visual-No damage Pre-heating temperature 80-120,time10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s |
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours. |
| 9 | Flexural strength | No damage | Base boardAl2O3 /PCB PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Unit: mm Test it under the flexural status Electro static capacity change rate C/C10% Flexural deepth 452 452 |
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S |
| 11 | Thermal shock |
| Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity |
| 12 | Temperature moisture exposure |
| Test it after place 242 hours normal temp & humidity Temperature 402 Humidity 90~95%RH time 500+24 hours |
| 13 | High temperature exposure |
| Test it after place 48 hours under normal pressure & temperature Temperature 1253 Time 100048 hours Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage |
| 14 | PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. |
Embossed Plastic Taping Dimensions (mm)
| Code | Tape size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing Dimensions (mm)
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions (unit: mm)
| Unit:mm | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | 3000 (T>1.35mm) | |
| 1210 | 2000 (T1.60mm) | |
| 1808 | 3000 (T>1.60mm) | |
| 1812 | 2000 | |
| 1812 | 1000 (T1.85mm) | |
| 1000 (T>1.85mm) | ||
| 800 | ||
| 500 |
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering WWave Soldering
Precautions For Use
The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory.
- Soldering Profile: To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
- Manual Soldering: Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
2509251626_AIDE-CAPACITOR-1206X7R333K631NT_C49326782.pdf
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