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quality MLCC capacitor AIDE CAPACITOR 1206X7R333K631NT designed for AC DC DC DC power chargers and LCD backlight power supply units factory
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quality MLCC capacitor AIDE CAPACITOR 1206X7R333K631NT designed for AC DC DC DC power chargers and LCD backlight power supply units factory
quality MLCC capacitor AIDE CAPACITOR 1206X7R333K631NT designed for AC DC DC DC power chargers and LCD backlight power supply units factory
quality MLCC capacitor AIDE CAPACITOR 1206X7R333K631NT designed for AC DC DC DC power chargers and LCD backlight power supply units factory
>
Specifications
Voltage Rating:
630V
Capacitance:
33nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R333K631NT
Model Number:
1206X7R333K631NT
Package:
1206
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

Item Description
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 25025, 251250, 2522500 (V)
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T Tape/Reel, P Bag packing (PE)

Construction

Item Description
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickel layer
5 Tin layer

Dimensions (mm)

Part Number Dimension (mm) L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40

Specification and Testing Method

No. Item Specification/Requirement Testing Method
1 Temperature -55~+125
2 Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
3 Static Capacity Meet standard specification and tolerance
  • NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10 % 1.0 0.2Vrms; 1000 pF 1KHz10% 1.0 0.2Vrms
  • X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.0 0.2Vrms; 10uF 120Hz24 0.5 0.1Vrms
4 Dissipation Factor (DF)
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms.
  • X7R/X7T/X7P characteristic: see Note 1
  • Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5 IR Insulation Resistance
  • NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF
  • X7R/X7T/X7P Characteristic : IR10000M,C25nF; IR*Cr100S,C25nF
Testing condition : Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA
6 Hi-pot (DC)
  • Ur=100V,...............2.5 x rated voltage
  • Ur=200V/250V,.... 2.0 x rated voltage
  • Ur=450/500/630V,1.5 x rated voltage
  • 1KVUr2KV,.......1.2 x rated voltage
  • 2KVUr,...............1.1 x rated voltage
Voltage Raising time:110S, Voltage maintaining time2S
7 Solderability soldering area90% Visual-No damage Pre-heating temperature 80-120,time10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s
8 Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours.
9 Flexural strength No damage Base boardAl2O3 /PCB PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Unit: mm Test it under the flexural status Electro static capacity change rate C/C10% Flexural deepth 452 452
10 Terminal bonding strength No visual damage Applied Force: 5N Duration: 101S
11 Thermal shock
  • NPO Characteristic; C/C2.5% or 0.25pF ( larger reading)
  • X7R/X7P- characteristic: C/C0.5%
  • X7T characteristic C/C10%
Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity
12 Temperature moisture exposure
  • Visual No visual damage
  • Electrost atic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%
  • DF 2 times initial standard
  • IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading)
Test it after place 242 hours normal temp & humidity Temperature 402 Humidity 90~95%RH time 500+24 hours
13 High temperature exposure
  • Visual No visual damage
  • Electrost atic capacitance change rate NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF 2 X initial standard
  • IR NPO : IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading)
Test it after place 48 hours under normal pressure & temperature Temperature 1253 Time 100048 hours Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage
14 PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2.

Embossed Plastic Taping Dimensions (mm)

Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing Dimensions (mm)

Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Paper size A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max

Reel Dimensions (unit: mm)

Unit:mm A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Packing Quantity

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T>1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T>1.60mm)
1812 2000
1812 1000 (T1.85mm)
1000 (T>1.85mm)
800
500

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering WWave Soldering

Precautions For Use

The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory.

  1. Soldering Profile: To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
  2. Manual Soldering: Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
  3. Optimum Solder Amount for Reflow Soldering
  4. Recommended Soldering amounts

2509251626_AIDE-CAPACITOR-1206X7R333K631NT_C49326782.pdf

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