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Specifications
Voltage Rating:
100V
Capacitance:
470nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R474K101NT
Model Number:
1206X7R474K101NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. It is available in various sizes and temperature characteristics like C0G, X7R, and X5R, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Coupling | ||
| Wave filtering | ||
| Resonant applications | ||
| Typical Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Item 1: Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Item 2: Temperature Characteristic | C0G, X7R, X5R | |
| Item 3: Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | |
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Item 5: Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | |
| Item 6: Terminal Composition | Au/Ag-Ni-Sn | |
| Item 7: Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer |
| Dimension (mm) - British System | 0201 (0.02*0.01 inch), 0402 (0.04*0.02 inch), 0603 (0.06*0.03 inch), 0805 (0.08*0.05 inch), 1206 (0.12*0.06 inch), 1210 (0.12*0.10 inch), 1808 (0.18*0.08 inch), 1812 (0.18*0.12 inch), 1825 (0.18*0.25 inch), 2211 (0.22*0.11 inch), 2225 (0.22*0.25 inch) | |
| Dimension (mm) - Metric System | 0603: 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB 1005 (0402): 1.000.15 L, 0.500.15 W, 0.500.10 T, 0.200.10 WB 1608 (0603): 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB, 0.600.10 WB 2012 (0805): 2.000.20 L, 1.250.20 W, 0.800.20 T, 1.000.20 WB, 0.500.20 WB, 1.250.20 WB, 0.800.20 WB 3216 (1206): 3.200.30 L, 1.600.30 W, 1.000.20 T, 1.250.20 WB, 0.600.30 WB, 1.600.30 WB 3225 (1210): 3.200.30 L, 2.500.30 W, 2.70 T, 0.800.30 WB 4520 (1808): 4.500.40 L, 2.000.20 W, 2.70 T, 0.800.30 WB 4532 (1812): 4.500.40 L, 3.200.30 W, 3.50 T, 0.800.30 WB 4563 (1825): 4.500.40 L, 6.300.50 W, 3.50 T, 0.800.30 WB 5750 (2220): 5.700.50 L, 5.000.50 W, 3.50 T, 1.000.40 WB 5763 (2225): 5.700.50 L, 6.300.50 W, 6.20 T, 1.000.40 WB | |
| Temperature Range | -55~+125 | |
| Static Capacity Tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 for exceptions based on rated voltage and capacitance. | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) Testing Condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90%, Visual-No damage. Pre-heating: 80-120 (10-30s), Solder temp: 2455, Solder time: 20.5s | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating: 100-200 (102 s), Soldering temp: 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. Flexural depth: 452 mm. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% 5 cycles, tested after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Test after 242 hours at normal temp & humidity. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | |
| High Temperature Exposure | Visual: No visual damage. Test after 48 hours at normal pressure & temperature. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | |
| PCB Flexural Strength | No crack and other defect. IR test after soldering MLCC on PCB. | |
| Embossed Plastic Taping Dimensions | 0805: T=1.550.20, A=2.350.20, B=8.000.20, C=3.500.05, D=1.750.10, E=4.000.10, F=2.000.10, G=4.000.10, H=1.50 -0/+0.10, J=1.50 Max 1206: T=1.950.20, A=3.600.20, B=8.000.20, C=3.500.05, D=1.750.10, E=4.000.10, F=2.000.10, G=4.000.1, H=1.50 -0/+0.10, J=1.85 Max 1210: T=2.700.10, A=3.420.10, B=8.000.10, C=3.500.05, D=1.750.10, E=4.000.10, F=2.000.05, G=4.000.10, H=1.55 -0/+0.10, J=3.2 Max 1808: T=2.200.10, A=4.950.10, B=12.000.10, C=5.500.05, D=1.750.10, E=4.000.10, F=2.000.05, G=4.000.10, H=1.50 -0/+0.10, J=3.0 Max 1812: T=3.660.10, A=4.950.10, B=12.000.10, C=5.500.05, D=1.750.10, E=8.000.10, F=2.000.05, G=4.000.10, H=1.55 -0/+0.10, J=4.0 Max | |
| Paper Tape Reel Packing Dimensions | 1005: W1=0.240.02, L1=0.450.02, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.30 Below 0201: W1=0.370.10, L1=0.670.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below 0402: W1=0.650.10, L1=1.150.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below 0603: A=1.100.10, B=1.900.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max 0805: A=1.450.15, B=2.300.15, C=8.00.15, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max 1206: A=1.800.20, B=3.400.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max | |
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N | |
| Packing Quantity | 0603 Paper T/R: 4000 pcs 0805 Paper T/R: 4000 pcs 0805 Plastic T/R: 3000 pcs 1206 Plastic T/R (T1.35mm): 3000 pcs 1206 Plastic T/R (T>1.35mm): 2000 pcs 1210 Plastic T/R (T1.60mm): 3000 pcs 1210 Plastic T/R (T>1.60mm): 2000 pcs 1808 Plastic T/R: 1000 pcs 1812 Plastic T/R (T1.85mm): 1000 pcs 1812 Plastic T/R (T>1.85mm): 800 pcs 1812 Plastic T/R: 500 pcs | |
| Soldering Method | RReflow Soldering, WWave Soldering. Refer to Page 13 for specific recommendations by size, characteristics, voltage, and capacitance. | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode under severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and used to avoid direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and chip surface temperature T150 during preheating.
2509251626_AIDE-CAPACITOR-1206X7R474K101NT_C49326784.pdf
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