Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of standard sizes and offer different temperature characteristics (C0G, X7R, X5R) with precise capacitance tolerances and rated voltages.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Application Field | Coupling | High voltage circuits |
| Wave Filtering | High voltage circuits | |
| Resonant | High voltage circuits | |
| Power Supplies | Switch power supplier, AC-DC power charger, DC-DC power charger | |
| Other | Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Construction & Dimension | Construction Items | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer |
| Dimension (mm) - 0201 (0603) | L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05 | |
| Dimension (mm) - 0402 (1005) | L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10 | |
| Dimension (mm) - 0603 (1608) | L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10, (Additional WB: 0.600.10) | |
| Dimension (mm) - 0805 (2012) | L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 0.500.20, (Additional WB: 1.000.20, 1.250.20, 0.800.20) | |
| Dimension (mm) - 1206 (3216) | L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 0.600.30, (Additional WB: 1.250.20, 1.600.30) | |
| Dimension (mm) - 1210 (3225) | L: 3.200.30, W: 2.500.30, T: 2.70, WB: 0.800.30 | |
| Dimension (mm) - 1808 (4520) | L: 4.500.40, W: 2.000.20, T: 2.70, WB: 0.800.30 | |
| Dimension (mm) - 1812 (4532) | L: 4.500.40, W: 3.200.30, T: 3.50, WB: 0.800.30 | |
| Dimension (mm) - 1825 (4563) | L: 4.500.40, W: 6.300.50, T: 3.50, WB: 0.800.30 | |
| Dimension (mm) - 2220 (5750) | L: 5.700.50, W: 5.000.50, T: 3.50, WB: 1.000.40 | |
| Dimension (mm) - 2225 (5763) | L: 5.700.50, W: 6.300.50, T: 6.20, WB: 1.000.40 | |
| Testing Condition - Normal | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Condition - Relative | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Specifications & Testing Methods | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | |
| Reliability Tests | Solderability | Soldering area90%, Visual-No damage |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | |
| Flexural Strength | No damage, Electrostatic capacity change rate C/C10% | |
| Terminal Bonding Strength | No visual damage, Applied Force: 5N, Duration: 101S | |
| Environmental Tests | Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% |
| Temperature Moisture Exposure | Visual-No visual damage; Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | |
| High Temperature Exposure | Visual-No visual damage; Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | |
| PCB Flexural Strength | No crack and other defect | IR measurement after soldering MLCC on PCB |
| Packing | Embossed Plastic Taping Dimensions | Refer to detailed table for 0805 to 1812 types |
| Paper Tape Reel Packing Dimensions | Refer to detailed table for 1005, 0201, 0402, 0603, 0805, 1206 types | |
| Packing Quantity | Paper T/R (Pcs) | 0201: 10000, 0402: 10000, 0603: 4000, 0805: 4000, 1206: 4000 |
| Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm), 1812: 500 | |
| Soldering Recommendations | Soldering Methods | RReflow Soldering, WWave Soldering |
| Temperature Profile | Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. |
2509251626_AIDE-CAPACITOR-1206X7R475M101NT_C49326787.pdf
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