Product Overview
High-performance Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions in power supplies, chargers, networking interfaces, and lighting systems. They offer reliable performance across a wide temperature range and are available in various sizes and specifications to meet diverse industrial needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | |||||||||||
| Usage | Coupling, wave filtering, resonant in high voltage circuits | ||||||||||
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||
| 2. Testing Conditions | |||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See Dimension Table | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| Packing | T Tape/Reel, P Bag packing (PE) | ||||||||||
| 4. Construction and Dimension | |||||||||||
| Item | Construction | ||||||||||
| 1 | Ceramic dielectric | ||||||||||
| 2 | Inner electrode | ||||||||||
| 3 | Outer electrode | ||||||||||
| 4 | Nickle layer | ||||||||||
| 5 | Tin layer | ||||||||||
| Dimension (mm) | Part number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| 5. Specification and Testing Method | |||||||||||
| 1 | Temperature | -55~+125 | |||||||||
| 2 | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3 | Static Capacity | Meet standard specification and tolerance | See detailed specification | ||||||||
| 4 | Dissipation Factor (DF) | See detailed specification (NPO, X7R/X7T/X7P characteristics) | See detailed specification | ||||||||
| 5 | IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||
| 6 | Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||
| 7 | Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| 9 | Flexural strength | No damage. Electro static capacity change rate |C/C| 10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. | ||||||||
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| 11 | Thermal shock | NPO Characteristic: |C/C| 2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: |C/C| 0.5%; X7T characteristic: |C/C| 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||||||||
| 12 | Temperature moisture exposure | Visual No visual damage. Electrostatic capacitance change rate: NPO characteristic: |C/C| 2% or 1pF (larger reading); X7R/X7T/X7P characteristic: |C/C| 10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | ||||||||
| 13 | High temperature exposure | Visual No visual damage. Electrostatic capacitance change rate: NPO: |C/C| 2% or 1pF (larger reading); X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | ||||||||
| 14 | PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||||
| 6. EMBOSSED PLASTIC TAPING (T/R) | |||||||||||
| Code | Tape size | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| 7. Paper tape reel packing | |||||||||||
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Code | Paper size | A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 8. Packing Quantity | |||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | 3000 (T>1.35mm) | ||||||||||
| 1210 | 2000 (T1.60mm) | ||||||||||
| 1808 | 3000 (T>1.60mm) | ||||||||||
| 1812 | 2000 | ||||||||||
| 1812 | 1000 | 1000 (T1.85mm) | |||||||||
| 800 (T>1.85mm) | |||||||||||
| 500 | |||||||||||
| 9. Precautions For Use | |||||||||||
| 1 | Soldering Profile | Follow the temperature profile in the adjacent graph. | |||||||||
| 2 | Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature. | |||||||||
| 3 | Optimum Solder Amount for Reflow Soldering | ||||||||||
| 4 | Recommended Soldering amounts | ||||||||||
| 10. Recommended Soldering Method | |||||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | |||||||
| 1005 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| 0201 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Y5V | / | / | R | ||||||||
| 0402 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Y5V | / | / | R | ||||||||
| 0603 | NPO | / | / | R/W | |||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | ||||||||
| C1uf | R/W | ||||||||||
| Y5V | / | C1uf | R | ||||||||
| C1uf | R/W | ||||||||||
| 0805 | NPO | / | / | R/W | |||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | ||||||||
| C4.7uf | R/W | ||||||||||
| Y5V | / | C1uf | R | ||||||||
| C1uf | R/W | ||||||||||
| 1206 | NPO | / | / | R/W | |||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | ||||||||
| C10uf | R/W | ||||||||||
| Y5V | / | C10uf | R | ||||||||
| C10uf | R/W | ||||||||||
| 1210 | NPO | / | / | R | |||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Y5V | / | / | R | ||||||||
| 11. The temperature profile for soldering | |||||||||||
| Preheating temperature difference (Soldering temp - Surface temp) | T150 | ||||||||||
2509251626_AIDE-CAPACITOR-1210X7R104K251NT_C49326809.pdf
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