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Specifications
Voltage Rating:
500V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G101J501NT
Model Number:
1206C0G101J501NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Item 1: Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See Dimension Table |
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Item 3: Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A | |
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| Item 5: Rated Voltage (DC) | 25025V, 251250V, 2522500V | N/A | |
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A | |
| Item 7: Packing | T Tape/Reel, P Bag packing (PE) | N/A | |
| Construction and Dimension | Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | N/A | N/A |
| Dimension (mm): | See Dimension Table | Digital Caliper | |
| Temperature Characteristic | -55~+125 | N/A | |
| Visual/Dimension | No Damage, Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | NPO Characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms | Meet standard specification and tolerance | |
| X7R/X7T/X7P Characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | Meet standard specification and tolerance | ||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2Vrms. | N/A | |
| X7R/X7T/X7P Characteristic: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions) | N/A | ||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | N/A | |
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | N/A | ||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A | |
| Solderability | Soldering area90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual | |
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |
| X7R: C/C15% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||
| X7T: -33% C/C22% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||
| X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. Flexural depth 452. | Visual | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | N/A | |
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| X7R/X7P characteristic: C/C0.5% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||
| X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||
| Temperature Moisture Exposure | Visual: No visual damage. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| Electrostatic Capacitance Change Rate: NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||
| DF: 2 times initial standard IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||
| High Temperature Exposure | Visual: No visual damage. | Temperature 1253, Time 100048 hours. Test after place 48 hours under normal pressure & temperature. Charging and discharging current 50mA Max. | |
| Electrostatic Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | Temperature 1253, Time 100048 hours. Test after place 48 hours under normal pressure & temperature. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). | ||
| DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Test after place 48 hours under normal pressure & temperature. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). | ||
| PCB Flexural Strength | No crack and other defect. IR. Soldering the MLCC on the PCB, then pressing direction based on the photo. | N/A | |
| Embossed Plastic Taping | Dimensions A, B, C, D, E, F, G, H, J, T for 0805 to 1812 types. | See Taping Dimension Tables | |
| Paper Tape Reel Packing | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t for 1005, 0201, 0402 types. Dimensions A, B, C, D, E, F, G, H, J, T for 0603, 0805, 1206 types. | See Taping Dimension Tables | |
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | N/A | |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | N/A | |
| Packing Quantity | See Packing Quantity Table | N/A | |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. See detailed table for size, characteristics, voltage, and capacitance. | N/A | |
| Soldering Temperature Profile | Preheating temperature difference: T150. | N/A | |
Dimension Table
| Part number | Dimension (mm) | British system | Metric system | L | W | T | WB |
|---|---|---|---|---|---|---|---|
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | 0.600.10 | |
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20 | 0.500.20 | 1.250.20 |
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20 | 0.600.30 | 1.600.30 |
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Packing Quantity Table
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm) |
| 1210 | - | 2000 (T1.60mm) |
| 1808 | - | 3000 (T>1.60mm) |
| 1812 | - | 2000 (T1.85mm) |
| 1812 | - | 1000 (T>1.85mm) |
| 800 | ||
| 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: To avoid cracks from sudden temperature changes, follow the recommended temperature profile.
- Manual Soldering: Manual soldering poses a risk of thermal cracks. Handle soldering irons carefully, paying attention to tip selection and temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
2509251626_AIDE-CAPACITOR-1206C0G101J501NT_C48579655.pdf
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