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quality Multi Layer Ceramic Capacitors Featuring AIDE CAPACITOR 1206X7R106K500NT for High Voltage Performance factory
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quality Multi Layer Ceramic Capacitors Featuring AIDE CAPACITOR 1206X7R106K500NT for High Voltage Performance factory
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Specifications
Voltage Rating:
50V
Capacitance:
10uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R106K500NT
Model Number:
1206X7R106K500NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for a wide range of power supply and electronic circuits such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance under specified conditions.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: ROHS/REACH compliant

Technical Specifications

Item Description/Specification Testing Method/Conditions
Application Field
Coupling, wave filtering, resonant in high voltage circuits Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC)
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa (No special requirements)
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa For data not matching testing specification
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 See Page 1 for L*W (inch/mm) details
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R0=8.0pF, 100=10pF, 101=100pF
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250=25V, 251=250V, 252=2500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T: Tape/Reel, P: Bag packing (PE)
Construction
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer
Dimension (mm)
Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF).
Dissipation Factor (DF) NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for X7R/X5R/X6S/X7S/Y5V exceptions.
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S.
Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% Initial capacitance testing: Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature.
Flexural Strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452.
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
Thermal shock NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
Temperature moisture exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
High temperature exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. Step Temperature: Lower limit temperature 303 min, Normal temp & humidity 2~3 min, Upper limit temperature 303 min, Normal temp & humidity 2~3 min.
PCB flexural strength No crack and other defect Soldering the MLCC on the PCB, then pressing direction based on photo. See Page 7 for SIZE A, B, C values for different sizes (0805 to 2220).
EMBOSSED PLASTIC TAPING (mm)
Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
PAPER TAPE REEL PACKING (mm)
Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Papersize A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (unit: mm)
Unit A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping specification
Top tape peeling strength 0.1N < peeling strength < 0.7N No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing quantity (Pcs)
Size Paper T/R Plastic T/R
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T1.60mm)
1812 2000
1812 1000 (T1.85mm)
1000 (T1.85mm)
800
500
Soldering Method Recommendation
Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
/ C1uf R/W
Y5V / C1uf R
/ C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
/ C4.7uf R/W
Y5V / C1uf R
/ C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
/ C10uf R/W
Y5V / C10uf R
/ C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
Soldering Method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-1206X7R106K500NT_C49326770.pdf

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