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Specifications
Voltage Rating:
50V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G101J500NT
Model Number:
0603C0G101J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: RoHS compliant, REACH compliant.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| General Specifications | |||||
| Application Field | Coupling, wave filtering, resonant in high voltage circuits such as switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T (Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing) | ||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | ||||
| Solderability | Soldering area 90% | Visual-No damage. Pre-heating: 80-120 (10-30s). Solder: Lead-free. Flux. Soldering Temp: 2455. Solder Time: 20.5s. | |||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating: 100-200 (102s). Soldering Temp: 2655. Solder Time: 51s. Cleaning with solvent. Room temp, 242 hours. | |||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N. Duration: 101S. | |||
| PCB Flexural Strength | No crack and other defect | IR Soldering MLCC on PCB, pressing direction based on photo. | |||
| Specifications and Testing Methods | |||||
| Temperature | -55~+125 | N/A | |||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: see Note 1. | N/A | |||
| IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C10nF). X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF). | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Initial capacitance testing: Pre-heating 150 (1 hour), then 48 hours under normal pressure & temperature. | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temp 1 hour, 241 hours placement, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | |||
| Dimensions (mm) | |||||
| Part Number | Dimension (mm) | British System | Metric System | ||
| 0201 | 0603 | 0.600.10 (L) | 0.300.05 (W) | 0.300.05 (T) | 0.100.05 (WB) |
| 0402 | 1005 | 1.000.15 (L) | 0.500.15 (W) | 0.500.10 (T) | 0.200.10 (WB) |
| 0603 | 1608 | 1.600.20 (L) | 0.800.15 (W) | 0.800.15 (T) | 0.300.10 (WB), 0.600.10 (WB) |
| 0805 | 2012 | 2.000.20 (L) | 1.250.20 (W) | 0.800.20 (T) | 1.000.20 (WB), 0.500.20 (WB), 1.250.20 (WB), 0.800.20 (WB) |
| 1206 | 3216 | 3.200.30 (L) | 1.600.30 (W) | 1.000.20 (T) | 1.250.20 (WB), 0.600.30 (WB), 1.600.30 (WB) |
| 1210 | 3225 | 3.200.30 (L) | 2.500.30 (W) | 2.70 (T) | 0.800.30 (WB) |
| 1808 | 4520 | 4.500.40 (L) | 2.000.20 (W) | 2.70 (T) | 0.800.30 (WB) |
| 1812 | 4532 | 4.500.40 (L) | 3.200.30 (W) | 3.50 (T) | 0.800.30 (WB) |
| 1825 | 4563 | 4.500.40 (L) | 6.300.50 (W) | 3.50 (T) | 0.800.30 (WB) |
| 2220 | 5750 | 5.700.50 (L) | 5.000.50 (W) | 3.50 (T) | 1.000.40 (WB) |
| 2225 | 5763 | 5.700.50 (L) | 6.300.50 (W) | 6.20 (T) | 1.000.40 (WB) |
| Packing Details | |||||
| Packing Method | T: Tape/Reel, P: Bag packing (PE) | N/A | |||
| Embossed Plastic Taping (0805-1812) | Dimensions (A, B, C, D, E, F, G, H, J, T) provided for various sizes. | N/A | |||
| Paper Tape Reel Packing (1005-1206) | Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided for various sizes. | N/A | |||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | N/A | |||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N | N/A | |||
| Packing Quantity | Provided for Paper T/R and Plastic T/R for various sizes. | N/A | |||
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burnout, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: Follow the temperature profile graph to avoid cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature contact.
- Optimum Solder Amount for Reflow Soldering.
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations provided based on size, temperature characteristics, rated voltage, and capacitance.
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and chip surface temperature T 150 during preheating.
2509251626_AIDE-CAPACITOR-0603C0G101J500NT_C48579252.pdf
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