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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603C0G1R5C500NT for High Voltage Power Supply Circuits factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603C0G1R5C500NT for High Voltage Power Supply Circuits factory
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Specifications
Voltage Rating:
50V
Capacitance:
1.5pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G1R5C500NT
Model Number:
0603C0G1R5C500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. Available in multiple sizes and temperature characteristics, these MLCCs offer reliable performance under specified conditions.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out)
  • RoHS/REACH Compliance: Meets standard

Technical Specifications

Item Description/Specification Testing Method
Application Field Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) N/A
Testing Conditions (Normal) Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa N/A
Testing Conditions (Relative) Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa N/A
Part Number Description Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 N/A
Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%) N/A
Nominal Electrostatic Capacity: 8R0=8.0pF, 100=10pF, 101=100pF N/A
Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% N/A
Rated Voltage (DC): 250=25V, 251=250V, 252=2500V N/A
Terminal Composition: Au/Ag-Ni-Sn N/A
Packing: T Tape/Reel, P Bag packing(PE) N/A
Dimensions (mm) See table below Digital Calliper
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer N/A
Packing Quantity See table below N/A
Dimensions (mm)
Part NumberDimension (mm) LDimension (mm) WDimension (mm) TWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.200.500.20
1206 (3216)3.200.301.600.301.000.200.600.30
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
N/A
Temperature Range -55~+125 N/A
Static Capacity Tolerance NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms
X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms		 N/A
Dissipation Factor (DF) NPO: DF0.56 (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1		 N/A
Insulation Resistance (IR) NPO: IR50000M (C10nF), IR*Cr500S (C10nF)
X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF)		 Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90%, No Damage Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF (larger reading)
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%		 Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature.
Flexural Strength No damage. Electro static capacity change rate C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: C/C2.5% or 0.25pF (larger reading)
X7R/X7P: C/C0.5%
X7T: C/C10%		 Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
High Temperature Exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect. IR Soldering the MLCC on the PCB, then pressing direction based on the photo.
Embossed Plastic Taping Dimensions (mm) See table below N/A
Paper Tape Reel Packing Dimensions (mm) See table below N/A
Reel Dimensions (mm) 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. N/A
Top Tape Peeling Strength 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. Standard
Soldering Method RReflow Soldering, WWave Soldering See table below
Soldering Profile See adjacent graph (refer to the graph in the enclosure page). N/A

Embossed Plastic Taping Dimensions (mm)

CodeTape size ABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max

Paper Tape Reel Packing Dimensions (mm)

CodePaper size W1L1DCBP1P2P0dt
10050.24 0.020.45 0.028.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.30 Below
02010.37 0.100.67 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
04020.65 0.101.15 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below

Paper Tape Reel Packing Dimensions (mm) for 0603, 0805, 1206 types

CodePaper size ABCDEFGHJT
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max

Packing Quantity

DimensionPaper T/R (Pcs)Plastic T/R (Pcs)
06034000-
080540003000 (T1.35mm)
1206-3000 (T1.60mm)
1210-2000 (T1.85mm)
1808-1000
1812-800
1812-500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent failure, follow the precautions for safety and application notes. If you have questions about handling precautions, contact the engineering section or factory.

  • Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Handle soldering irons carefully to prevent thermal cracks. Pay attention to the soldering iron tip selection and temperature.
  • Optimum Solder Amount for Reflow Soldering: Recommended.
  • Recommended Soldering amounts: Recommended.

2509251626_AIDE-CAPACITOR-0603C0G1R5C500NT_C48579255.pdf

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