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quality medium and high voltage multilayer ceramic capacitor AIDE CAPACITOR 0603X7R103K101NT for power supply applications factory
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quality medium and high voltage multilayer ceramic capacitor AIDE CAPACITOR 0603X7R103K101NT for power supply applications factory
>
Specifications
Voltage Rating:
100V
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R103K101NT
Model Number:
0603X7R103K101NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Medium and High Voltage Multilayer Ceramic Capacitors (MLCCs) are designed for applications requiring reliable performance in high-voltage circuits. They are suitable for coupling, wave filtering, and resonant functions in power supplies, chargers, networking interfaces, and lighting systems. The MLCCs offer a wide range of capacitance values, temperature characteristics, and voltage ratings to meet diverse application needs.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: RoHS/REACH compliant

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Application Field Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC).
Testing Condition: Normal (Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa)
Relative Condition: (Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa)
3. Part Number Description Item Description Example
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 1812
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) X7R
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF) 684 (680000pF or 0.68uF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% M (20%)
5. Rated Voltage (DC) 25025, 251250, 2522500 (V) 251 (250V)
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out) Au/Ag-Ni-Sn
7. Packing T Tape/Reel, P Bag packing (PE) T
4. Construction and Dimension Construction 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer
Dimension (mm) See table below
Part NumberDimension (mm)British SystemMetric SystemLWTWB
020106030.600.100.300.050.300.050.100.05
040210051.000.150.500.150.500.100.200.10
060316081.600.200.800.150.800.150.300.100.600.10
080520122.000.201.250.200.800.201.000.200.500.20
120632163.200.301.600.301.000.201.250.200.600.30
121032253.200.302.500.302.700.800.30
180845204.500.402.000.202.700.800.30
181245324.500.403.200.303.500.800.30
182545634.500.406.300.503.500.800.30
222057505.700.505.000.503.501.000.40
222557635.700.506.300.506.201.000.40
5. Specification and testing method Temperature -55~+125
Visual/ Dimension 1, No Damage 2, Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Dissipation factor (DF) NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
X7R/X7T/X7P: See Note 1		 NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF)
X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF)
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C10nF
X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF		 Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature.
DF Refer to NO#4
IR Refer to NO#5
Flexural strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452.
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
11. Thermal shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12. Temperature moisture exposure Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
13. High temperature exposure Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature.
14. PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB, Then pressing direction base on the photo.
6. EMBOSSED PLASTIC TAPING Embossed tape reel packing for 0805(2012)~1812(4532) type See table below
CodeTape sizeABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
CodePapersizeW1L1DCBP1P2P0dt
10050.24 0.020.45 0.028.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.30 Below
02010.37 0.100.67 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
04020.65 0.101.15 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
CodePapersizeABCDEFGHJT
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
Structure of leader part and end part of the carrier paper Reel Dimensions (unit: mm) Unit:mm
Taping specification Top tape peeling strength (a) Paper Taping Reel type A B C D E F G
7REEL1782.03.0130.5210.521 or Bigger1010.512max
13REEL3302.03.0130.5210.521 or Bigger1010.512max
(b) Embossed TapingStandard: 0.1N < peeling strength < 0.7NNo paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing quantity See table below
SizePaper T/R PcsPlastic T/R (Pcs
06034000
080540003000 (T1.35mm)
12063000 (T>1.35mm)2000 (T1.60mm)
12103000 (T>1.60mm)2000
18081000 (T1.85mm)
18121000 (T>1.85mm)800
1812500
8. Precautions For Use The MLCC may fail in a short circuit mode when subjected to severe conditions beyond specified ratings, potentially resulting in burn out, flaming or glowing. Follow "precautions for safety" and Application Notes. Contact engineering for handling questions.
Soldering Profile To avoid cracks from sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
Manual Soldering High risk of thermal cracks. Ensure careful handling of soldering iron, tip selection, and temperature contact.
9. Recommended Soldering Method See table below
SizeTemperature CharacteristicsRated VoltageCapacitanceSoldering Method
1005NPO//R
X7R/X5R/X7S/X6S//R
0201NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0402NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0603NPO//R/W
X7R/X5R/X7S/X6S/C1ufR
/C1ufR/W
Y5V/C1ufR
/C1ufR/W
0805NPO//R/W
X7R/X5R/X7S/X6S/C4.7ufR
/C4.7ufR/W
Y5V/C1ufR
/C1ufR/W
1206NPO//R/W
X7R/X5R/X7S/X6S/C10ufR
/C10ufR/W
Y5V/C10ufR
/C10ufR/W
1210NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
10. The temperature profile for soldering While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R103K101NT_C48579277.pdf

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