Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are engineered for medium and high voltage requirements, offering reliable performance in demanding environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling | High voltage circuits | |||||||||
| Wave filtering | High voltage circuits | ||||||||||
| Resonant | High voltage circuits | ||||||||||
| Switch power supplier | Medium and High voltage MLCC | ||||||||||
| AC-DC power charger | Medium and High voltage MLCC | ||||||||||
| DC-DC power charger | Medium and High voltage MLCC | ||||||||||
| Networking/Communication interface | Medium and High voltage MLCC | ||||||||||
| LCD backlight unit power supplier | Medium and High voltage MLCC | ||||||||||
| Amperite of energy saving lamps | Medium and High voltage MLCC | ||||||||||
| General | Medium and High voltage MLCC | ||||||||||
| Testing Conditions | Normal Condition Temperature | 15~35 | |||||||||
| Normal Condition Humidity | 45~75%RH | ||||||||||
| Normal Condition Atmosphere | 86~106kPa | ||||||||||
| Relative Condition Temperature | 252 | ||||||||||
| Relative Condition Humidity | 60~70%RH | ||||||||||
| Relative Condition Atmosphere | 86~106kPa | ||||||||||
| Part Number Description | Dimension Code Examples | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| Packing | T Tape/Reel, P Bag packing (PE) | ||||||||||
| Construction | 1. Ceramic dielectric | N/A | |||||||||
| 2. Inner electrode | N/A | ||||||||||
| 3. Outer electrode | N/A | ||||||||||
| 4. Nickle layer | N/A | ||||||||||
| 5. Tin layer | N/A | ||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specifications and Testing Methods | Temperature Range | -55~+125 | N/A | ||||||||
| Visual/Dimension | No Damage, Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |||||||||
| Static Capacity | Meet standard specification and tolerance | See detailed specification for NPO and X7R/X7T/X7P characteristics | |||||||||
| Dissipation Factor (DF) | See detailed specification for NPO and X7R/X7T/X7P characteristics | See detailed specification for testing frequency and voltage | |||||||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | |||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,...2.5 x rated voltage; Ur=200V/250V,...2.0 x rated voltage; Ur=450/500/630V,...1.5 x rated voltage; 1KVUr2KV,...1.2 x rated voltage; 2KVUr,...1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S | |||||||||
| Solderability | Soldering area90%, Visual-No damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Refer to NO#3 for initial capacitance testing (Pre-heating 150/1 hour, then place 48 hours under normal pressure & temperature). | |||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, Time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||||||||
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. | |||||||||
| PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing according to diagram. | |||||||||
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | N/A | N/A | N/A |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | N/A | N/A | N/A | |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | N/A | ||||||||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | Notes | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| 0603 | 4000 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| 0805 | 4000 | 3000 (T1.35mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | |
| 1206 | 3000 (T>1.35mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| 1210 | 2000 (T1.60mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| 1812 | 1000 (T1.85mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| Precautions for Use | MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To avoid cracks from sudden temperature changes, follow the recommended soldering profile. Manual soldering requires careful handling to prevent thermal cracks. Ensure optimum solder amount for reflow soldering. Refer to recommended soldering methods and temperature profiles for various sizes and characteristics. | ||||||||||
2509251626_AIDE-CAPACITOR-0603X7R152K500NT_C48579288.pdf
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