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Specifications
Voltage Rating:
200V
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R331K201NT
Model Number:
0603X7R331K201NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various standard sizes and temperature characteristics, offering reliable performance under specified electrical and mechanical conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||
| Testing Conditions: Normal (15~35, 45~75%RH, 86~106kPa) or Relative (252, 60~70%RH, 86~106kPa) | |||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||
| Terminal Composition | Au/Ag-Ni-Sn | (From the inside out) | |
| Packing | T (Tape/Reel), P (Bag packing) | ||
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | ||
| Dimension (mm) | L, W, T, WB | See Page 2 for detailed dimensions by code | |
| Specification and Testing Method | Temperature | -55~+125 | |
| Visual/Dimension | No Damage, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance | Frequency and Voltage dependent on characteristic (NPO, X7R/X7T/X7P) | |
| Dissipation Factor (DF) | See Page 3 for details by characteristic (NPO, X7R/X7T/X7P) | Frequency and Voltage dependent on capacity | |
| IR Insulation Resistance | NPO: 50000M or IR*Cr500S; X7R/X7T/X7P: 10000M or IR*Cr100S | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Based on rated voltage (Ur) | |
| Solderability | Soldering area90% | Pre-heating 80-120, Solder 2455, Time 20.5s | |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating 100-200, Solder 2655, Time 51s | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 1hour, then 48 hours under normal conditions | |
| Flexural Strength | No damage, Electro static capacity change rate 10% | Base board: Al2O3 /PCB, Flexural depth: 1mm, Bend speed: 0.5mm/sec | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | 5 cycles, tested after 242 hours at normal temp & humidity | |
| Temperature Moisture Exposure | Visual: No damage; Capacity change: NPO: 2% or 1pF; X7R/X7T/X7P: 10%; DF 2x initial standard; IR: NPO: 2500M or IR*Cr25S; X7R/X7T/X7P: 1000M or IR*Cr25S | 402, 90~95%RH, 50024 hours | |
| High Temperature Exposure | Visual: No damage; Capacity change: NPO: 2% or 1pF; X7R/X7T/X7P: 20%; DF 2x initial standard; IR: NPO: 4000M or IR*Cr40S; X7R/X7T/X7P: 2000M or IR*Cr50S | 1253, 100048 hours, Voltage dependent | |
| PCB Flexural Strength | No crack and other defect | Applied force based on size (See Page 7) | |
| Embossed Plastic Taping | Dimensions A, B, C, D, E, F, G, H, J, T for various sizes | See Page 8 | |
| Paper Tape Reel Packing | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t for various sizes | See Page 9 | |
| Reel Dimensions | 7REEL (1782.0), 13REEL (3302.0) | See Page 10 | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard | |
| Packing Quantity | See Page 11 for quantity by size and packing type | ||
| Soldering Method | RReflow Soldering, WWave Soldering | Recommended method by Size, Characteristic, Voltage, and Capacitance (See Page 13) | |
2509251626_AIDE-CAPACITOR-0603X7R331K201NT_C48579299.pdf
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