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Specifications
Voltage Rating:
50V
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R331K500NT
Model Number:
0603X7R331K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
High-performance Multi-layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer reliable performance across a range of operating conditions, with robust construction and adherence to stringent testing standards.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||||||||
| Switch power supplier | |||||||||||
| AC-DC power charger | |||||||||||
| DC-DC power charger | |||||||||||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | ||||||||||
| Temperature Characteristic | C0G | 0 30 PPM/ | |||||||||
| X7R / X5R | 15% | ||||||||||
| Construction | 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | ||||||||||
| 3 | Outer electrode | ||||||||||
| 4 | Nickel layer | ||||||||||
| 5 | Tin layer | ||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Packing | T | Tape/Reel | |||||||||
| P | Bag packing (PE) | ||||||||||
| Specifications & Testing Methods | Temperature Range | -55~+125 | |||||||||
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V) 2.0 x rated voltage (Ur=200V/250V) 1.5 x rated voltage (Ur=450/500/630V) 1.2 x rated voltage (1KVUr2KV) 1.1 x rated voltage (2KVUr) | Voltage Raising time: 110S, Voltage maintaining time2S | |||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |||||||||
| Flexural Strength | No damage | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | |||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P Characteristic: C/C0.5% X7T Characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||
| Temperature Moisture Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||||||||
| High Temperature Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |||||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagrams. | |||||||||
| Embossed Plastic Taping (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Paper Tape Reel Packing (mm) | Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (mm) | Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | 3000 (T>1.35mm) | ||||||||||
| 1210 | 2000 (T1.60mm) | ||||||||||
| 1808 | 3000 (T>1.60mm) | ||||||||||
| 1812 | 2000 | ||||||||||
| 1812 above | 1000 (T1.85mm) | ||||||||||
| 800 (T>1.85mm) | |||||||||||
| 500 | |||||||||||
Precautions for Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to avoid direct contact with the ceramic body and prevent thermal cracks. Select appropriate soldering iron tips and temperatures.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Recommended Soldering Method:
- R: Reflow Soldering
- W: Wave Soldering
- Soldering Temperature Profile: During preheating, maintain a temperature difference of T 150 between the soldering temperature and the surface temperature of the chips.
2509251626_AIDE-CAPACITOR-0603X7R331K500NT_C48579300.pdf
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