Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are engineered for medium and high voltage requirements, offering reliable performance in demanding electronic systems.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A | |
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimension (mm) - British System | 0201 (0.02*0.01 inch) | L*W (mm): 0.50*0.25 | |
| Dimension (mm) - British System | 0402 (0.04*0.02 inch) | L*W (mm): 1.00*0.50 | |
| Dimension (mm) - British System | 0603 (0.06*0.03 inch) | L*W (mm): 1.60*0.80 | |
| Dimension (mm) - British System | 0805 (0.08*0.05 inch) | L*W (mm): 2.00*1.25 | |
| Dimension (mm) - British System | 1206 (0.12*0.06 inch) | L*W (mm): 3.20*1.60 | |
| Dimension (mm) - British System | 1210 (0.12*0.10 inch) | L*W (mm): 3.20*2.50 | |
| Dimension (mm) - British System | 1808 (0.18*0.08 inch) | L*W (mm): 4.50*2.00 | |
| Dimension (mm) - British System | 1812 (0.18*0.12 inch) | L*W (mm): 4.50*3.20 | |
| Dimension (mm) - British System | 1825 (0.18*0.25 inch) | L*W (mm): 4.50*6.30 | |
| Dimension (mm) - British System | 2211 (0.22*0.11 inch) | L*W (mm): 5.70*2.8 | |
| Dimension (mm) - British System | 2225 (0.22*0.25 inch) | L*W (mm): 5.70*6.30 | |
| Specification and Testing Method | Temperature | -55~+125 | N/A |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). X7R/X7T/X7P: See Note 1. | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF). | |
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Initial capacitance testing: Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | |
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452. | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S. | |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |
| High temperature exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48hours under normal pressure & temperature. | |
| Taping Specification | Embossed Plastic Taping | Details for 0805 to 1812 types (Tape size A, B, C, D, E, F, G, H, J, T) | N/A |
| Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size W1, L1, D, C, B, P1, P2, P0, d, t; Tape size A, B, C, D, E, F, G, H, J, T) | N/A | |
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1005: 4000, 1206: 4000. Plastic T/R (Pcs): 0805: 3000, 1206: 3000, 1210: 2000, 1808: 2000, 1812: 1000. | N/A |
| Precautions For Use | Soldering Profile | Follow the temperature profile in the adjacent graph. | N/A |
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | N/A | |
| Recommended Soldering Method | Size & Characteristic | NPO / R, X7R/X5R/X7S/X6S / R, Y5V / R (for larger capacitance values, R/W) | RReflow Soldering, WWave Soldering |
| Soldering Temperature Profile | Preheating | Temperature difference between soldering temperature and surface temperature of chips: T150. | N/A |
2509251626_AIDE-CAPACITOR-0805C0G220J500NT_C48579570.pdf
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