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quality Multi Layer Ceramic Capacitors AIDE CAPACITOR 0805C0G300J500NT with Au Ag Ni Sn Terminal Composition factory
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quality Multi Layer Ceramic Capacitors AIDE CAPACITOR 0805C0G300J500NT with Au Ag Ni Sn Terminal Composition factory
>
Specifications
Voltage Rating:
50V
Capacitance:
30pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G300J500NT
Model Number:
0805C0G300J500NT
Package:
0805
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in power supplies such as switch power suppliers, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer reliable performance under specified conditions and are available in various sizes and temperature characteristics.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • RoHS/REACH Compliance: Meets RoHS and REACH standards.

Technical Specifications

Item Description Specification
Application Field High voltage circuits: switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps. (Medium and High voltage MLCC).
Testing Conditions:
Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Code 0201 L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25
0402 L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50
0603 L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80
0805 L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25
1206 L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60
1210 L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50
1808 L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00
1812 L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20
1825 L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30
2211 L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8
2225 L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF
Tolerance of Electrostatic Capacity B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
Rated Voltage (DC) 250 = 25V, 251 = 250V, 252 = 2500V
Packing T: Tape/Reel, P: Bag packing (PE)
Construction 1. Ceramic dielectric N/A
2. Inner electrode N/A
3. Outer electrode N/A
4. Nickel layer N/A
5. Tin layer N/A
Dimension (mm) British System Metric System
L W T WB 0201 0.600.10 0.300.05 0.300.05 0.100.05
L W T WB 0402 1.000.15 0.500.15 0.500.10 0.200.10
L W T WB 0603 1.600.20 0.800.15 0.800.15 0.300.10
L W T WB 0805 2.000.20 1.250.20 0.800.20 0.500.20
L W T WB 1206 3.200.30 1.600.30 1.000.20 0.600.30
L W T WB 1210 3.200.30 2.500.30 2.70 0.800.30
L W T WB 1808 4.500.40 2.000.20 2.70 0.800.30
L W T WB 1812 4.500.40 3.200.30 3.50 0.800.30
L W T WB 1825 4.500.40 6.300.50 3.50 0.800.30
L W T WB 2220 5.700.50 5.000.50 3.50 1.000.40
L W T WB 2225 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method Temperature Range -55~+125
Visual/Dimension No Damage, Dimension meet Spec. Tested by naked eye and digital caliper.
Static Capacity Meets standard specification and tolerance.
NPO: 1MHz10% for 1000pF, 1KHz10% for >1000pF, 1.00.2Vrms.
X7R/X7T/X7P: 1KHz10% for 10uF, 120Hz24 for >10uF, 1.00.2Vrms or 0.50.1Vrms.
Dissipation Factor (DF) Refer to Note 1. Specific frequencies and voltages apply based on capacity.
Insulation Resistance (IR) NPO: IR50000M or IR*Cr500S (for C10nF and C>10nF respectively).
X7R/X7T/X7P: IR10000M or IR*Cr100S (for C25nF and C>25nF respectively). Tested at rated voltage, 605s, 75% Humidity, 255.
Hi-pot (DC) No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (e.g., 2.5x for Ur=100V, 2.0x for Ur=200V/250V, etc.). Voltage raising time: 1-10s, maintaining time: 2s.
Reliability Testing Solderability Soldering area 90%. Visual-No damage. Pre-heating 80-120 (10-30s), lead free solder, flux. Soldering temp 2455, time 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area 90%. Pre-heating 100-200 (102s), soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours.
Flexural Strength No damage. Base board Al2O3/PCB (1.6mm thickness). Flexural depth 1mm, bend speed 0.5mm/sec. Electrostatic capacity change rate 10%.
Terminal Bonding Strength No visual damage. Applied Force: 5N, Duration: 101S.
Environmental Testing Thermal Shock NPO: |C/C|2.5% or 0.25pF. X7R/X7P: |C/C|0.5%. X7T: |C/C|10%. 5 cycles of thermal shock after pre-conditioning. Tested after 242 hours at normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage. Capacity change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Tested at 402, 90~95%RH for 50024 hours.
High Temperature Exposure Visual: No visual damage. Capacity change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Tested at 1253 for 100048 hours with specified voltages.
PCB Flexural Strength No crack and other defect. IR tested. Dimensions A, B, C provided for various sizes (e.g., 0805, 1206, 1210, 1812, 2220).
Taping Embossed Plastic Taping Dimensions A, B, C, D, E, F, G, H, J, T provided for 0805 to 1812 types.
Paper Tape Reel Packing Dimensions W1, L1, D, C, B, P1, P2, P0, d, t provided for 1005, 0201, 0402, 0603, 0805, 1206 types.
Reel Dimensions 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max.
13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max.
Top Tape Peeling Strength Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling.
Packing Quantity Paper T/R (Pcs): 4000 (0603, 0805), 3000 (1206).
Plastic T/R (Pcs): 3000 (0805, 1206, 1210), 2000 (1808, 1812), 1000 (1812 above). Specific quantities vary by size and thickness.
Soldering Method Recommendation RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance.
Soldering Temperature Profile Preheating temperature difference T150.

Precautions for Use

MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burn out, flaming, or glowing, adhere to the following precautions:

  • Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control. Avoid direct contact of the tip with the ceramic body.
  • Optimum Solder Amount & Recommended Soldering Amounts: Refer to provided guidelines for reflow soldering.

2509251626_AIDE-CAPACITOR-0805C0G300J500NT_C48579572.pdf

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