Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in power supplies such as switch power suppliers, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer reliable performance under specified conditions and are available in various sizes and temperature characteristics.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | High voltage circuits: switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps. (Medium and High voltage MLCC). | |
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| Dimension Code | 0201 | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 |
| 0402 | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | |
| 0603 | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | |
| 0805 | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | |
| 1206 | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | |
| 1210 | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | |
| 1808 | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | |
| 1812 | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | |
| 1825 | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | |
| 2211 | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8 | |
| 2225 | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction | 1. Ceramic dielectric | N/A |
| 2. Inner electrode | N/A | |
| 3. Outer electrode | N/A | |
| 4. Nickel layer | N/A | |
| 5. Tin layer | N/A | |
| Dimension (mm) | British System | Metric System |
| L W T WB | 0201 | 0.600.10 0.300.05 0.300.05 0.100.05 |
| L W T WB | 0402 | 1.000.15 0.500.15 0.500.10 0.200.10 |
| L W T WB | 0603 | 1.600.20 0.800.15 0.800.15 0.300.10 |
| L W T WB | 0805 | 2.000.20 1.250.20 0.800.20 0.500.20 |
| L W T WB | 1206 | 3.200.30 1.600.30 1.000.20 0.600.30 |
| L W T WB | 1210 | 3.200.30 2.500.30 2.70 0.800.30 |
| L W T WB | 1808 | 4.500.40 2.000.20 2.70 0.800.30 |
| L W T WB | 1812 | 4.500.40 3.200.30 3.50 0.800.30 |
| L W T WB | 1825 | 4.500.40 6.300.50 3.50 0.800.30 |
| L W T WB | 2220 | 5.700.50 5.000.50 3.50 1.000.40 |
| L W T WB | 2225 | 5.700.50 6.300.50 6.20 1.000.40 |
| Specification and Testing Method | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec. Tested by naked eye and digital caliper. | |
| Static Capacity | Meets standard specification and tolerance. NPO: 1MHz10% for 1000pF, 1KHz10% for >1000pF, 1.00.2Vrms. X7R/X7T/X7P: 1KHz10% for 10uF, 120Hz24 for >10uF, 1.00.2Vrms or 0.50.1Vrms. | |
| Dissipation Factor (DF) | Refer to Note 1. Specific frequencies and voltages apply based on capacity. | |
| Insulation Resistance (IR) | NPO: IR50000M or IR*Cr500S (for C10nF and C>10nF respectively). X7R/X7T/X7P: IR10000M or IR*Cr100S (for C25nF and C>25nF respectively). Tested at rated voltage, 605s, 75% Humidity, 255. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (e.g., 2.5x for Ur=100V, 2.0x for Ur=200V/250V, etc.). Voltage raising time: 1-10s, maintaining time: 2s. | |
| Reliability Testing | Solderability | Soldering area 90%. Visual-No damage. Pre-heating 80-120 (10-30s), lead free solder, flux. Soldering temp 2455, time 20.5s. |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating 100-200 (102s), soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | |
| Flexural Strength | No damage. Base board Al2O3/PCB (1.6mm thickness). Flexural depth 1mm, bend speed 0.5mm/sec. Electrostatic capacity change rate 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Environmental Testing | Thermal Shock | NPO: |C/C|2.5% or 0.25pF. X7R/X7P: |C/C|0.5%. X7T: |C/C|10%. 5 cycles of thermal shock after pre-conditioning. Tested after 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Tested at 402, 90~95%RH for 50024 hours. | |
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Tested at 1253 for 100048 hours with specified voltages. | |
| PCB Flexural Strength | No crack and other defect. IR tested. Dimensions A, B, C provided for various sizes (e.g., 0805, 1206, 1210, 1812, 2220). | |
| Taping | Embossed Plastic Taping | Dimensions A, B, C, D, E, F, G, H, J, T provided for 0805 to 1812 types. |
| Paper Tape Reel Packing | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t provided for 1005, 0201, 0402, 0603, 0805, 1206 types. | |
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 3000 (1206). Plastic T/R (Pcs): 3000 (0805, 1206, 1210), 2000 (1808, 1812), 1000 (1812 above). Specific quantities vary by size and thickness. | |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance. | |
| Soldering Temperature Profile | Preheating temperature difference T150. | |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burn out, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control. Avoid direct contact of the tip with the ceramic body.
- Optimum Solder Amount & Recommended Soldering Amounts: Refer to provided guidelines for reflow soldering.
2509251626_AIDE-CAPACITOR-0805C0G300J500NT_C48579572.pdf
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