quality multi layer ceramic capacitor AIDE CAPACITOR 0805X7R101K101NT for in communication interfaces and DC DC power chargers factory

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Specifications

Voltage Rating:

100V

Capacitance:

100pF

Temperature Coefficient:

X7R

Tolerance:

±10%

Mfr. Part #:

0805X7R101K101NT

Model Number:

0805X7R101K101NT

Package:

0805

Key Attributes

Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.

Product Attributes

Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item

Description

Specification/Requirement

Testing Method

1. Application Field

Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC)

Testing Conditions:
Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa

2. Part Number Description

Example: 1812 X7R 684 M 251 N T
Dimension Code
Temperature characteristic (C0G, X7R, X5R)
Nominal electrostatic capacity (pF)
Tolerance of electrostatic capacity (B, C, D, F, G, J, K, M, Z)
Rated voltage (DC) (V)
Terminal composition (Au/Ag-Ni-Sn)
Packing (T: Tape/Reel, P: Bag packing)

3. Construction and Dimension

Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer

N/A

Dimension (mm)

Part number	Dimension (mm) L	Dimension (mm) W	Dimension (mm) T	WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40

N/A

4. Specification and Testing Method

Temperature Range

-55~+125

Naked eye (Visual inspection), Digital calliper

Visual/Dimension

1. No Damage
2. Dimension meet Spec

Naked eye (Visual inspection), Digital calliper

Static Capacity

NPO Characteristic:
1000pF: 1MHz10%, 1.00.2Vrms
>1000pF: 1KHz10%, 1.00.2Vrms

X7R/X7T/X7P Characteristic:
10uF: 1KHz10%, 1.00.2Vrms
>10uF: 120Hz24, 0.50.1Vrms

N/A

Dissipation Factor (DF)

NPO Characteristic:
DF0.56, Cr5 pF
DF1.5[(150/Cr)+7]10-4 (5pFCr50pF)
DF0.15%, (50pFCr)
Cr1000pF: 1MHz10%, 1V0.2rms
Cr1000pF: 1KHz10%, 1V0.2rms

X7R/X7T/X7P Characteristic:
Cr10uF: 1KHz10%, 1V0.1rms
Cr10uF: 120Hz24Hz, 0.5V0.1rms

N/A

IR Insulation Resistance

NPO Characteristic:
IR50000M, C10nF
IR*Cr500S, C10nF
Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA

X7R/X7T/X7P Characteristic:
IR10000M, C25nF
IR*Cr100S, C25nF

N/A

Hi-pot (DC)

Ur=100V: 2.5 x rated voltage
Ur=200V/250V: 2.0 x rated voltage
Ur=450/500/630V: 1.5 x rated voltage
1KVUr2KV: 1.2 x rated voltage
2KVUr: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time: 2S

N/A

Solderability

Soldering area90%

Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s

Resistance to the heat of soldering

No visual damage, soldering area90%

Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.

Electrostatic capacity change rate

NPO Characteristic: C/C0.5% or 0.5pF (larger reading)
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%

N/A

Flexural strength

No damage. Electro static capacity change rate C/C10%

Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec.

Terminal bonding strength

No visual damage

Applied Force: 5N, Duration: 101S

Thermal shock

NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
X7R/X7P characteristic: C/C0.5%
X7T characteristic: C/C10%

Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.

Temperature moisture exposure

Electrostatic capacitance change rate:
NPO characteristic: C/C2% or 1pF (larger reading)
X7R/X7T/X7P characteristic: C/C10%
DF: 2 times initial standard
IR:
NPO characteristic: IR2500M or IR*Cr25S (Lower reading)
X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)

Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.

High temperature exposure

Electrostatic capacitance change rate:
NPO: C/C2% or 1pF (larger reading)
X7R/X7T/X7P: C/C20%
DF: 2 X initial standard
IR:
NPO: IR4000M or IR*Cr40S (Lower reading)
X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)

Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature.

PCB flexural strength

No crack and other defect

Soldering the MLCC on the PCB. Pressing direction based on diagrams.

5. Embossed Plastic Taping

Taping Dimensions (mm)

Code	Tape size A	B	C	D	E	F	G	H	J	T
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max

N/A

6. Paper Tape Reel Packing

Dimensions (unit: mm)

Code	Paper size W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.240.02	0.450.02	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.30 Below
0201	0.370.10	0.670.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
0402	0.650.10	1.150.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

N/A

Reel Dimensions (unit: mm)

Type	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max

N/A

Top tape peeling strength

0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Standard

7. Packing Quantity

Paper T/R (Pcs)

Dimension	0603	0805	1206	1210	1808	1812	1812
Quantity	4000	4000

N/A

Plastic T/R (Pcs)

Dimension	0805	1206	1210	1812	1812
T1.35mm	3000	3000	2000	1000	800
T1.35mm		3000	3000	1000	500

N/A

8. Precautions For Use

MLCCs may fail in a short circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. Follow soldering profiles and handling precautions. Contact engineering for questions.

9. Recommended Soldering Method

Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	C1uf		R
		C1uf		R/W
	Y5V	C1uf		R
		C1uf		R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	C4.7uf		R
		C4.7uf		R/W
	Y5V	C1uf		R
		C1uf		R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	C10uf		R
		C10uf		R/W
	Y5V	C10uf		R
		C10uf		R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R

Soldering method: RReflow Soldering, WWave Soldering

10. The temperature profile for soldering

While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0805X7R101K101NT_C48579586.pdf

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