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Specifications
Voltage Rating:
50V
Capacitance:
4.7nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R472K500NT
Model Number:
0805X7R472K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 2. Part Number Description | Item | Description | Example |
| 1. Dimension Code | Size (L*W in inch/mm) | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | |
| 3. Nominal Electrostatic Capacity | Value in pF (e.g., 8R0=8.0pF, 100=10pF, 101=100pF) | 684 (680000pF or 680nF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M (20%) | |
| 5. Rated Voltage (DC) | Value in V (e.g., 250=25V, 251=250V, 252=2500V) | 251 (250V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn | Au/Ag-Ni-Sn | |
| 7. Packing | T Tape/Reel, P Bag packing (PE) | T | |
| 3. Construction and Dimension | Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | - | - |
| Dimension (mm): | Part number, L, W, T, WB | 0201 (0.600.10 x 0.300.05 x 0.300.05) to 2225 (5.700.50 x 6.300.50 x 6.20) | |
| 4. Specification and Testing Method | Temperature Range | -55~+125 | - |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | Frequency and Voltage specific to characteristic | |
| Dissipation Factor (DF) | Specification varies by characteristic (NPO, X7R/X7T/X7P) and capacitance value. See Note 1 for details. | Frequency and Voltage specific to characteristic | |
| IR Insulation Resistance | NPO: 50000M or IR*Cr 500S (C10nF / C>10nF) X7R/X7T/X7P: 10000M or IR*Cr 100S (C25nF / C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | Dielectric breakdown or damage check (Voltage varies based on rated voltage Ur) | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| 5. Solderability | Soldering area 90% | Visual-No damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 6. Resistance to the heat of soldering | Visual-No damage, soldering area 90% | - | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 7. Electrostatic capacity change rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C22% X7P: 10% | DF, IR, Electrostatic capacity change rate | - |
| 8. Flexural strength | Electro static capacity change rate: 10% | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 9. Terminal bonding strength | - | No visual damage | Applied Force: 5N, Duration: 101S |
| 10. Thermal shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | - | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| 11. Temperature moisture exposure | Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10% DF: 2 times initial standard IR: NPO: 2500M or IR*Cr25S; X7R/X7T/X7P: 1000M or IR*Cr25S | Visual No visual damage | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| 12. High temperature exposure | Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20% DF: 2 X initial standard IR: NPO: 4000M or IR*Cr40S; X7R/X7T/X7P: 2000M or IR*Cr50S | Visual No visual damage | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage) to 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. |
| 13. PCB flexural strength | No crack and other defect | IR | Soldering the MLCC on the PCB. Pressing direction based on diagrams. Sizes: 0805(2012) to 2220(5750). |
| 14. Embossed Plastic Taping | Tape size dimensions (A, B, C, D, E, F, G, H, J, T) | 0805 to 1812 types | See Page 8 for detailed dimensions. |
| 15. Paper Tape Reel Packing | Paper size dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) | 1005 (0402) to 1206 (3216) types | See Page 9 for detailed dimensions. |
| 16. Reel Dimensions | Dimensions (A, B, C, D, E, F, G) | 7REEL (1782.0), 13REEL (3302.0) | See Page 10 for detailed dimensions. |
| 17. Taping Specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N | Paper Taping Reel type, Embossed Taping Standard. |
| 18. Packing Quantity | Pieces per reel | Varies by size and tape type (e.g., 4000 pcs for 0603 Paper T/R, 3000 pcs for 0805 Plastic T/R) | See Page 11 for details. |
| 19. Soldering Method | Recommended methods (RReflow Soldering, WWave Soldering) | Specific recommendations based on size, temperature characteristics, rated voltage, and capacitance. | See Page 13 for details. |
| 20. Soldering Profile | Temperature profile for soldering | Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. | See adjacent graph (enclosure page) and Page 14. |
Precautions For Use
MLCCs may fail in short or open circuit modes when subjected to conditions exceeding specified ratings or conditions, potentially leading to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering or factory for handling questions.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
2509251626_AIDE-CAPACITOR-0805X7R472K500NT_C48579637.pdf
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