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Specifications
Voltage Rating:
2kV
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R102K202NT
Model Number:
1206X7R102K202NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits such as switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interface, LCD backlight unit power suppliers, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Item | Description | Example |
| 1. Dimension Code | See table below for codes and dimensions (inch/mm) | 1812 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0, 100=10, 101=100 (pF) | 684 | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | 251 | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | T | |
| Construction and Dimension | Construction Items | Description | N/A |
| Dimension (mm) | Part number, British system, Metric system, L, W, T, WB | See table on Page 2 | |
| Specification and Testing Method | 1. Temperature | -55~+125 | N/A |
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| 3. Static Capacity | Meet standard specification and tolerance | See table on Page 3 | |
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: see Note 1 | See table on Page 3 | |
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Voltage Raising time: 110S, Voltage maintaining time: 2S (specific voltage based on rated voltage) | |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 9. Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11. Thermal Shock | Capacitance change rate: NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: -33% C/C22% | Run 5 cycles. Test after place 242 hours normal temp & humidity. | |
| 12. Temperature Moisture Exposure | Capacitance change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| 13. High Temperature Exposure | Capacitance change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 2x Rated voltage (for 100VV250V), 1.5x rated voltage (for 250VV1KV), 1.2x rated voltage (for 1KVV). Test after place 48hours under normal pressure & temperature. | |
| 14. PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on diagram. | |
| Packing Details | Embossed Plastic Taping (0805~1812) | Tape size dimensions (A, B, C, D, E, F, G, H, J, T) | See table on Page 8 |
| Paper Tape Reel Packing (1005~1206) | Paper tape dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) | See table on Page 9 | |
| Reel Dimensions | A, B, C, D, E, F, G | See table on Page 10 | |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | Standard | |
| Packing Quantity | Paper T/R (Pcs), Plastic T/R (Pcs) | See table on Page 11 | |
| Precautions For Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow "precautions for safety" and Application Notes. Consider soldering profile, manual soldering risks, optimum solder amount, and recommended soldering methods. | ||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering (specific recommendations based on size, characteristics, rated voltage, and capacitance) | ||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T 150 during preheating. | ||
2509251626_AIDE-CAPACITOR-1206X7R102K202NT_C48579681.pdf
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