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Specifications
Voltage Rating:
50V
Capacitance:
1.2pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G1R2C500NT
Model Number:
0603C0G1R2C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product line encompasses Medium and High Voltage Multilayer Ceramic Capacitors (MLCCs) designed for critical applications in high-voltage circuits. They are ideal for coupling, wave filtering, and resonant functions within power supplies, including switch mode power supplies (SMPS), AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs offer reliable performance across a range of demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Item 1: Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) |
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| Item 3: Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||
| Item 4: Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| Item 5: Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| Item 7: Packing | T Tape/Reel, P Bag packing (PE) | ||
| Construction and Dimension | Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | |
| Dimension (mm) | Part number | Dimension (mm) 0201 | L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05 0402 | L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10 0603 | L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10, 0.600.10 0805 | L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 1.000.20, 0.500.20, 1.250.20, 0.800.20 1206 | L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 1.250.20, 0.600.30, 1.600.30 1210 | L: 3.200.30, W: 2.500.30, T: 2.70, WB: 0.800.30 1808 | L: 4.500.40, W: 2.000.20, T: 2.70, WB: 0.800.30 1812 | L: 4.500.40, W: 3.200.30, T: 3.50, WB: 0.800.30 1825 | L: 4.500.40, W: 6.300.50, T: 3.50, WB: 0.800.30 2220 | L: 5.700.50, W: 5.000.50, T: 3.50, WB: 1.000.40 2225 | L: 5.700.50, W: 6.300.50, T: 6.20, WB: 1.000.40 | ||
| Specification and Testing Method | Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | NPO characteristic: Capacity 1000pF 1MHz10%, 1.00.2Vrms; 1000 pF 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: Capacity 10uF 1KHz10%, 1.00.2Vrms; 10uF 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions) | ||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current :50mA | |
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Tested under flexural status. Electro static capacity change rate: C/C10% | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |
| Temperature moisture exposure | Visual | No visual damage | Test after placing 242 hours at normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. |
| Electrostatic capacitance change rate | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | DF 2 times initial standard. IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | |
| High temperature exposure | Visual | No visual damage | Test after placing 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. |
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | |
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on provided photos. Size specifications for A, B, C are provided for different MLCC sizes (0805 to 2220). | |
| Packing (Embossed Plastic Taping) | Dimensions for tapes (A, B, C, D, E, F, G, H, J, T) | Details provided for 0805, 1206, 1210, 1808, 1812 sizes. | |
| Packing (Paper Tape Reel) | Dimensions for tapes (W1, L1, D, C, B, P1, P2, P0, d, t) | Details provided for 1005, 0201, 0402, 0603, 0805, 1206 sizes. | |
| Reel Dimensions | A, B, C, D, E, F, G | Details provided for 7' REEL (1782.0) and 13' REEL (3302.0). | |
| Taping Specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | (a) Paper Taping, (b) Embossed Taping |
| Packing Quantity | Paper T/R (Pcs) / Plastic T/R (Pcs) | Quantities vary by size and type (e.g., 0603 Paper T/R: 4000 Pcs, 0805 Plastic T/R: 3000 Pcs). | |
| Soldering Method Recommendation | Details provided for various sizes and temperature characteristics (NPO, X7R, X5R, X7S, X6S, Y5V) recommending Reflow Soldering (R) or Wave Soldering (W). | ||
| Soldering Temperature Profile | Preheating temperature difference between soldering temperature and surface temperature of chips: T150. | ||
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the temperature profile graph to avoid cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and select appropriate tip temperature.
- Optimum Solder Amount for Reflow Soldering: Recommended amounts are provided.
- Recommended Soldering amounts: Details are provided.
2509251626_AIDE-CAPACITOR-0603C0G1R2C500NT_C49326303.pdf
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