Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and communication systems. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminals)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
Part Number Description Example: 1812 X7R 684 M 251 N T
| Item | Description | Details |
|---|---|---|
| 1. Dimension Code | Size (inch/mm) | 0201: 0.02*0.01 / 0.50*0.25 0402: 0.04*0.02 / 1.00*0.50 0603: 0.06*0.03 / 1.60*0.80 0805: 0.08*0.05 / 2.00*1.25 1206: 0.12*0.06 / 3.20*1.60 1210: 0.12*0.10 / 3.20*2.50 1808: 0.18*0.08 / 4.50*2.00 1812: 0.18*0.12 / 4.50*3.20 1825: 0.18*0.25 / 4.50*6.30 2211: 0.22*0.11 / 5.70*2.8 2225: 0.22*0.25 / 5.70*6.30 |
| 2. Temperature Characteristic | Dielectric Type | C0G (030 PPM/), X7R (15%), X5R (15%) |
| 3. Nominal Electrostatic Capacity | Capacity Value (pF) | 8R0=8.0, 100=10, 101=100 |
| 4. Tolerance of Electrostatic Capacity | Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| 5. Rated Voltage (DC) | Voltage (V) | 250=25V, 251=250V, 252=2500V |
| 6. Terminal Composition | Plating | Au/Ag-Ni-Sn (From inside out) |
| 7. Packing | Packaging Type | T: Tape/Reel, P: Bag packing (PE) |
| Construction and Dimension | Ceramic dielectric | N/A |
| Inner electrode | N/A | |
| Outer electrode | N/A | |
| Nickle layer | N/A | |
| Tin layer | N/A | |
| Dimension (mm) - British System | L, W, T, WB values for each size (e.g., 0603: 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB) | |
| Dimension (mm) - Metric System | L, W, T, WB values for each size (e.g., 1608: 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB) | |
| Specification and Testing Method | Temperature | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | Meets standard specification and tolerance (NPO/X7R/X7T/X7P characteristics with specific frequency and voltage conditions) | |
| Dissipation Factor (DF) | Specific limits for NPO and X7R/X7T/X7P characteristics based on capacity and frequency. | |
| IR Insulation Resistance | NPO: 50000M or IR*Cr500S (C10nF/C>10nF); X7R/X7T/X7P: 10000M or IR*Cr100S (C25nF/C>25nF) | |
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), 1.5 x rated voltage (Ur=450/500/630V), 1.2 x rated voltage (1KVUr2KV), 1.1 x rated voltage (2KVUr) | |
| Solderability | Soldering area 90%, Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | |
| Electrostatic capacity change rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | |
| Flexural strength | No damage, Electro static capacity change rate 10% | |
| Terminal bonding strength | No visual damage | |
| Thermal shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | |
| Temperature moisture exposure | Visual No visual damage, Capacity change rate: NPO 2% or 1pF; X7R/X7T/X7P 10%; DF 2 times initial standard; IR: NPO 2500M or IR*Cr25S; X7R/X7T/X7P 1000M or IR*Cr25S | |
| High temperature exposure | Visual No visual damage, Capacity change rate: NPO 2% or 1pF; X7R/X7T/X7P 20%; DF 2 X initial standard; IR: NPO 4000M or IR*Cr40S; X7R/X7T/X7P 2000M or IR*Cr50S | |
| PCB flexural strength | No crack and other defect |
Testing Conditions
Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Packing Information
Embossed Plastic Taping: Available for 0805(2012) to 1812(4532) types with detailed tape dimensions.
Paper Tape Reel Packing: Available for 1005(0402) to 1206(3216) types, with specific dimensions for different sizes.
Reel Dimensions: 7' REEL (1782.0), 13' REEL (3302.0).
Top tape peeling strength: 0.1N < peeling strength < 0.7N for Embossed Taping.
Packing Quantity: Varies by size and taping type (e.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs).
Precautions for Use
Soldering Profile: Follow recommended temperature profiles to avoid cracks. Specific profiles for different sizes are indicated.
Manual Soldering: Exercise caution to prevent thermal cracks. Proper soldering iron tip selection and temperature control are crucial.
Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance.
Soldering Temperature Profile: Maintain temperature difference T150 between soldering temperature and surface temperature of chips during preheating.
2509251626_AIDE-CAPACITOR-0603C0G220J101NT_C49326308.pdf
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