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quality Multi layer ceramic capacitor AIDE CAPACITOR 0603C0G6R8D500NT ideal for AC DC DC DC power chargers and switch power supplies factory
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quality Multi layer ceramic capacitor AIDE CAPACITOR 0603C0G6R8D500NT ideal for AC DC DC DC power chargers and switch power supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
6.8pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G6R8D500NT
Model Number:
0603C0G6R8D500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Certifications: ROHS/REACH compliant

Technical Specifications

Part Number Description

Example: 1812 X7R 684 M 251 N T

Item Description
1. Dimension Code
  • 0201 (0.02*0.01 inch / 0.50*0.25 mm)
  • 0402 (0.04*0.02 inch / 1.00*0.50 mm)
  • 0603 (0.06*0.03 inch / 1.60*0.80 mm)
  • 0805 (0.08*0.05 inch / 2.00*1.25 mm)
  • 1206 (0.12*0.06 inch / 3.20*1.60 mm)
  • 1210 (0.12*0.10 inch / 3.20*2.50 mm)
  • 1808 (0.18*0.08 inch / 4.50*2.00 mm)
  • 1812 (0.18*0.12 inch / 4.50*3.20 mm)
  • 1825 (0.18*0.25 inch / 4.50*6.30 mm)
  • 2211 (0.22*0.11 inch / 5.70*2.8 mm)
  • 2225 (0.22*0.25 inch / 5.70*6.30 mm)
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R0=8.0pF, 100=10pF, 101=100pF
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250=25V, 251=250V, 252=2500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T: Tape/Reel, P: Bag packing (PE)

Construction

Item Description
1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer

Dimensions (mm)

Part Number Dimension (mm) L Dimension (mm) W Dimension (mm) T Dimension (mm) WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40

Specifications and Testing Methods

No. Item Specification/Requirement Testing Method
1 Temperature -55~+125
2 Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
3 Static Capacity Meet standard specification and tolerance
  • NPO characteristic: Capacity 1000pF: 1MHz10 %, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P characteristic: Capacity 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
4 Dissipation Factor (DF)
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • X7R/X7T/X7P Characteristic: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms
  • NPO: Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms
  • X7R/X7T/X7P: See Note 1
5 IR Insulation Resistance
  • NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF
  • X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF
 Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current:50mA
6 Hi-pot (DC) No dielectric breakdown or damage
  • Ur=100V: 2.5 x rated voltage
  • Ur=200V/250V: 2.0 x rated voltage
  • Ur=450/500/630V: 1.5 x rated voltage
  • 1KVUr2KV: 1.2 x rated voltage
  • 2KVUr: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time2S
7 Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8 Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9 Flexural Strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%.
10 Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
11 Thermal Shock
  • NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P characteristic: C/C0.5%
  • X7T characteristic: C/C10%
 Pre-condition(X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
12 Temperature Moisture Exposure
  • Visual: No visual damage
  • Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%
  • DF: 2 times initial standard
  • IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
13 High Temperature Exposure
  • Visual: No visual damage
  • Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
14 PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing direction based on the photo.

Embossed Plastic Taping Dimensions (mm)

Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing Dimensions (mm)

Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max

Reel Dimensions (mm)

Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Taping Specification

Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Packing Quantity

Size Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T>1.35mm)
1210 - 2000 (T1.60mm)
1808 - 3000 (T>1.60mm)
1812 - 2000
1812 and above - 1000 (T1.85mm)
800 (T>1.85mm)
500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Following precautions and application notes are essential for safety. Please contact the engineering section or factory for handling precautions.

1. Soldering Profile: Follow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature changes.

2. Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper handling of the soldering iron tip and temperature.

3. Optimum Solder Amount for Reflow Soldering

4. Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.


2509251626_AIDE-CAPACITOR-0603C0G6R8D500NT_C49326343.pdf

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