quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R103K100NT for AC DC DC DC power chargers and communication interfaces factory

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Specifications

Voltage Rating:

10V

Capacitance:

10nF

Temperature Coefficient:

X7R

Tolerance:

±10%

Mfr. Part #:

0603X7R103K100NT

Model Number:

0603X7R103K100NT

Package:

0603

Key Attributes

Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
Certifications: RoHS compliant, REACH compliant

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

1. Dimension Codes (L*W):

0201: 0.02*0.01 inch (0.50*0.25 mm)
0402: 0.04*0.02 inch (1.00*0.50 mm)
0603: 0.06*0.03 inch (1.60*0.80 mm)
0805: 0.08*0.05 inch (2.00*1.25 mm)
1206: 0.12*0.06 inch (3.20*1.60 mm)
1210: 0.12*0.10 inch (3.20*2.50 mm)
1808: 0.18*0.08 inch (4.50*2.00 mm)
1812: 0.18*0.12 inch (4.50*3.20 mm)
1825: 0.18*0.25 inch (4.50*6.30 mm)
2211: 0.22*0.11 inch (5.70*2.8 mm)
2225: 0.22*0.25 inch (5.70*6.30 mm)

2. Temperature Characteristic Codes:

C0G: 0 30 PPM/
X7R: 15%
X5R: 15%

3. Nominal Electrostatic Capacity (pF):

8R0: 8.0
100: 10
101: 100

4. Tolerance of Electrostatic Capacity:

B: 0.1pF
C: 0.25pF
D: 0.5pF
F: 1%
G: 2%
J: 5%
K: 10%
M: 20%
Z: +80%/-20%

5. Rated Voltage (DC) (V):

250: 25
251: 250
252: 2500

6. Packing:

T: Tape/Reel
P: Bag packing (PE)

Construction

1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer

Dimensions (mm)

Part Number	L	W	T	WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40

Specification and Testing Method

No.	Item	Specification/Requirement	Testing method
1	Temperature	-55~+125
2	Visual/ Dimension	1. No Damage 2. Dimension meet Spec	Naked eye (Visual inspection) Digital calliper
3	Static capacity	Meet standard specification and tolerance	NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10 % 1.0 0.2Vrms; 1000 pF 1KHz10% X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.0 0.2Vrms; 10uF 120Hz24 0.5 0.1Vrms
4	Dissipation factor (DF)	NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: see Note 1	Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms . Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5	IR Insulation Resistance	NPO Characteristic: IR50000M,C10nF; IRCr500S,C10nF X7R/X7T/X7P Characteristic : IR10000M,C25nF; IRCr100S,C25nF	Testing condition : Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA
6	Hi-pot (DC)	Ur=100V,...............2.5 x rated voltage Ur=200V/250V,.... 2.0 x rated voltage Ur=450/500/630V,1.5 x rated voltage 1KVUr2KV,.......1.2 x rated voltage 2KVUr,...............1.1 x rated voltage	Voltage Raising time:110S, Voltage maintaining time2S
7	Solderability	soldering area90%	Pre-heating temperature 80-120,time10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s
8	Resistance to the heat of soldering	Visual-No damage, soldering area90%	Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours.
9	Flexural strength	No damage	Base boardAl2O3 /PCB PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Unit: mm Test it under the flexural status Electro static capacity change rate C/C10% Flexural deepth 452 452
10	Terminal bonding strength	No visual damage	Applied Force: 5N Duration: 101S
11	Thermal shock	NPO Characteristic; C/C2.5% or 0.25pF ( larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic C/C10%	Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity
12	Temperature moisture exposure	Visual No visual damage electrost atic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading ); X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard IR NPO characteristic: IR2500M or IRCr25S (Lower reading); X7R/X7T/X7P : IR1000M or IRCr25S (Lower reading)	Temperature 402 Humidity 90~95%RH time 500+24 hours Test it after place 242 hours normal temp & humidity
13	High temperature exposure	Visual No visual damage electrost atic capacitance change rate NPO : C/C2% or 1pF (larger reading ); X7R/X7T/X7P: C/C20% DF 2 X initial standard IR NPO : IR4000M or IRCr40S (Lower reading); X7R/X7T/X7P : IR2000M or IRCr50S (Lower reading)	Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature Temperature 1253 Time 100048 hours Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage
14	PCB flexural strength	No crack and other defect	IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2.

Embossed Plastic Taping

Embossed tape reel packing for 0805(2012)~1812(4532) type

Code	Tape size	A	B	C	D	E	F	G	H	J
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max

Paper Tape Reel Packing

Paper tape reel packing for 10050402~12063216

Paper tape reel packing for 100502010402 type

Code	Papersize	W1	L1	D	C	B	P1	P2	P0	d
1005	0.24 0.02	0.45 0.02	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.30 Below
0201	0.37 0.10	0.67 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below
0402	0.65 0.10	1.15 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below

Paper tape reel packing for 0603, 0805, 1206 types

Code	Papersize	A	B	C	D	E	F	G	H	J
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

Reel Dimensions (unit: mm)

Unit:mm	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max

Taping Specification

Top tape peeling strength

Standard: 0.1N < peeling strength < 0.7N
No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Packing Quantity

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000
0805	4000	3000 T1.35mm
1206		3000 T1.35mm
1210		2000 T1.60mm
1808		3000 T1.60mm
1812		2000
1812	1000	500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Following precautions and application notes are recommended:

Soldering Profile: Avoid cracks due to sudden temperature changes by following the recommended temperature profile.
Manual Soldering: Handle soldering irons carefully to avoid direct contact with the ceramic body and select appropriate soldering iron tips and temperatures.
Optimum Solder Amount for Reflow Soldering
Recommended Soldering amounts

Recommended Soldering Method

Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R
			C1uf	R/W
	Y5V	/	C1uf	R
			C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R
			C4.7uf	R/W
	Y5V	/	C1uf	R
			C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R
			C10uf	R/W
	Y5V	/	C10uf	R
			C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R

Soldering methodRReflow Soldering WWave Soldering

The temperature profile for soldering

While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R103K100NT_C49326601.pdf

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