Online Service

Online Service

Contact Person
+86 136 6733 2386
quality Multi layer ceramic capacitor suitable for high voltage applications AIDE CAPACITOR 0603X7R334K500NT used in power supplies factory
<
quality Multi layer ceramic capacitor suitable for high voltage applications AIDE CAPACITOR 0603X7R334K500NT used in power supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
330nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R334K500NT
Model Number:
0603X7R334K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • RoHS/REACH Compliance: Meets standard

Technical Specifications

Item Specification/Requirement Testing Method
General Conditions
Normal Condition Temperature 15~35 -
Normal Condition Humidity 45~75%RH -
Normal Atmosphere 86~106kPa -
Relative Condition Temperature 252 -
Relative Condition Humidity 60~70%RH -
Relative Atmosphere 86~106kPa -
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 -
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) -
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF) -
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% -
5. Rated Voltage (DC) 250 25, 251 250, 252 2500 (V) -
6. Terminal Composition Au/Ag-Ni-Sn -
7. Packing T Tape/Reel, P Bag packing(PE) -
Construction and Dimension
Construction Items Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer -
Dimension (mm)
Part numberLWTWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.201.000.20
1206 (3216)3.200.301.600.301.000.201.250.20
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
-
Specification and Testing Method
Temperature -55~+125 -
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
Static Capacity Meet standard specification and tolerance
  • NPO characteristic: Capacity 1000pF 1MHz10% 1.00.2Vrms; 1000pF 1KHz10% 1.00.2Vrms
  • X7R/X7T/X7P characteristic: Capacity 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms
Dissipation Factor (DF) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. -
IR Insulation Resistance NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. -
Hi-pot (DC) Ur=100V,.......2.5 x rated voltage; Ur=200V/250V,.... 2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV,.......1.2 x rated voltage; 2KVUr,...............1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S -
Solderability soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours.
Electrostatic capacity change rate NPO Characteristic: C/C0.5% or 0.5pF larger reading. X7R :C/C15%. X7T -33% C/C22%. X7PC/C10%. -
Flexural strength No damage. Electro static capacity change rate C/C10%. Flexural depth 452. Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
Thermal shock NPO Characteristic; C/C2.5% or 0.25pF (larger reading). X7R/X7P- characteristic: C/C0.5%. X7T characteristic C/C10%. Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
Temperature moisture exposure Visual No visual damage. Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading). X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
High temperature exposure Visual No visual damage. Electrostatic capacitance change rate NPO : C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO : IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading). Charging and discharging current 50mA Max. Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage, 250VV1KV 1.5x rated voltage, 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect Soldering the MLCC on the PCB, Then pressing direction base on the photo.
Embossed Plastic Taping Dimensions (mm)
Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below
0201 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
0402 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
Code Papersize A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (mm)
Type A B C D E F G - - -
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max - - -
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max - - -
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. - - - - - - - -
Packing Quantity
Dimension Paper T/R (Pcs) Plastic T/R (Pcs) - - - - - - - -
0603 4000 - - - - - - - - -
0805 4000 3000 (T1.35mm) - - - - - - - -
1206 - 3000 (T1.35mm) 2000 (T1.60mm) 3000 (T1.60mm) - - - - - -
1210 - 2000 1000 (T1.85mm) 1000 (T1.85mm) 800 500 - - - -
1812 - - - - - - - - - -

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burnout, flaming, or glowing in the worst case. Adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.

  • Soldering Profile: Follow the provided temperature profile graph to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, paying attention to tip selection and temperature contact.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.


2509251626_AIDE-CAPACITOR-0603X7R334K500NT_C49326641.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max