Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics like C0G, X7R, and X5R, these capacitors offer reliable performance in demanding electronic circuits.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
RoHS/REACH Compliance: Meets standards

Technical Specifications

Item	Description	Specification
Application Field	High voltage circuits
	Function	Coupling, wave filtering, resonant
	Typical Applications	Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps
	Type	Medium and High voltage MLCC
Testing Conditions	Normal Condition	Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
	Relative Condition	Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
	Initial Capacitance Testing	Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature.
Part Number Description	Dimension Code	0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
	Temperature Characteristic	C0G (030 PPM/), X7R (15%), X5R (15%)
	Nominal Electrostatic Capacity	8R08.0, 10010, 101100 (pF)
	Tolerance of Electrostatic Capacity	B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
	Rated Voltage (DC)	25025, 251250, 2522500 (V)
	Terminal Composition	Au/Ag-Ni-Sn
	Packing	T (Tape/Reel), P (Bag packing)
Construction	Item	Description
Construction	1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer	N/A
Dimensions (mm)	Part Number	L	W	T	WB
	0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
	0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
	0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
	0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
	1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
	1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
	1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
	1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
	1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
	2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40
Specification and Testing Method	Temperature	-55~+125	N/A	N/A	N/A
	Visual/Dimension	1. No Damage, 2. Dimension meet Spec	Naked eye (Visual inspection), Digital calliper	N/A	N/A
	Static Capacity	Meet standard specification and tolerance	NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)	N/A	N/A
Dissipation Factor (DF)	NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1	NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF)	N/A	N/A
Insulation Resistance (IR)	NPO: IR50000M (C10nF), IRCr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF), IRCr100S (C>25nF)	Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA	N/A	N/A
Hi-pot (DC)	No dielectric breakdown or damage	Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S	N/A	N/A
Solderability	Soldering area90%	Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.	N/A	N/A
Resistance to the heat of soldering	No visual damage, soldering area90%	Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.	N/A	N/A
Electrostatic Capacity Change Rate	NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%	Refer to NO#3	N/A	N/A
Flexural Strength	No damage	Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452	N/A	N/A
Terminal Bonding Strength	No visual damage	Applied Force: 5N, Duration: 101S	N/A	N/A
Thermal Shock	NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10%	Pre-condition(X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.	N/A	N/A
Temperature Moisture Exposure	Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IRCr25S (Lower reading); X7R/X7T/X7P: IR1000M or IRCr25S (Lower reading).	Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.	N/A	N/A
High Temperature Exposure	Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IRCr40S (Lower reading); X7R/X7T/X7P: IR2000M or IRCr50S (Lower reading).	Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.	N/A	N/A
PCB Flexural Strength	No crack and other defect	IR Soldering the MLCC on the PCB, Then pressing direction base on the photo.	N/A	N/A
Embossed Plastic Taping	Type	Tape size (mm) A	B	C	D	E	F	G	H	J	T
	0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
	1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
	1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
	1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max
Paper Tape Reel Packing	Code	Paper size (mm) W1	L1	D	C	B	P1	P2	P0	d	t
	1005	0.24 0.02	0.45 0.02	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.30 Below
	0402	0.65 0.10	1.15 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below
	0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
Reel Dimensions (unit: mm)	Unit:mm	A	B	C	D	E	F	G	N/A	N/A	N/A
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max	N/A	N/A	N/A
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max	N/A	N/A	N/A
Taping Specification - Top tape peeling strength	Standard	0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Packing Quantity	Size	Paper T/R (Pcs)	Plastic T/R (Pcs)	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
0603	4000	-	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
0805	4000	3000 (T1.35mm)	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
1206	-	3000 (T1.60mm) / 2000 (T>1.60mm)	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
1210	-	1000 (T1.85mm) / 800 (T>1.85mm)	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
1812	-	500	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Recommended Soldering Method	Size	Capacitance	Soldering Method	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
1005	NPO	/	R	N/A	N/A	N/A	N/A	N/A	N/A	N/A
0603	X7R/X5R/X7S/X6S	C1uf	R	N/A	N/A	N/A	N/A	N/A	N/A	N/A
0805	X7R/X5R/X7S/X6S	C4.7uf	R/W	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Soldering Method Key	RReflow Soldering, WWave Soldering	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A

Note: The provided text contains extensive details on testing methods, specific conditions, and exceptions for various parameters. The table above summarizes key specifications and attributes. For complete details, refer to the original document.

2509251626_AIDE-CAPACITOR-0805X7R102K250NT_C49326697.pdf

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