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Specifications
Voltage Rating:
50V
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0402X7R103K500NT
Model Number:
0402X7R103K500NT
Package:
0402
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage circuits, including applications such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. It offers wave filtering and resonant capabilities in medium and high voltage applications.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | |||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| General Conditions | |||||||||||||||||||||||||||||||||||||||||
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | |||||||||||||||||||||||||||||||||||||||
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |||||||||||||||||||||||||||||||||||||||
| Part Number Description | |||||||||||||||||||||||||||||||||||||||||
| Part Number Structure | Example: 1812 X7R 684 M 251 N T | N/A | |||||||||||||||||||||||||||||||||||||||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | N/A | |||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |||||||||||||||||||||||||||||||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A | |||||||||||||||||||||||||||||||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | N/A | |||||||||||||||||||||||||||||||||||||||
| Terminal Composition | Au/Ag-Ni-Sn | N/A | |||||||||||||||||||||||||||||||||||||||
| Packing | T Tape/Reel, P Bag packing(PE) | N/A | |||||||||||||||||||||||||||||||||||||||
| Construction and Dimension | |||||||||||||||||||||||||||||||||||||||||
| Construction Items | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | N/A | |||||||||||||||||||||||||||||||||||||||
| Dimension (mm) | See table below | Digital calliper | |||||||||||||||||||||||||||||||||||||||
| |||||||||||||||||||||||||||||||||||||||||
| Specification and Testing Method | |||||||||||||||||||||||||||||||||||||||||
| Temperature | -55~+125 | N/A | |||||||||||||||||||||||||||||||||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||||||
| Static Capacity | Meet standard specification and tolerance | See table below | |||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | See table below | See table below | |||||||||||||||||||||||||||||||||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 for 1 hour, then 48 hours under normal conditions. | |||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | 5 cycles of thermal shock. Test after 242 hours at normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: 2500M or IR*Cr25S; X7R/X7T/X7P: 1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours at normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: 4000M or IR*Cr40S; X7R/X7T/X7P: 2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after 48 hours under normal conditions. | |||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction as per photo. | |||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping | |||||||||||||||||||||||||||||||||||||||||
| Taping Specification | Dimensions for 0805 to 1812 types | N/A | |||||||||||||||||||||||||||||||||||||||
| Reel Dimensions | 7REEL: 1782.0, 13REEL: 3302.0 | N/A | |||||||||||||||||||||||||||||||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard measurement | |||||||||||||||||||||||||||||||||||||||
| Packing Quantity | |||||||||||||||||||||||||||||||||||||||||
| Paper T/R (Pcs) | 0201: 10000, 0402: 10000, 0603: 5000, 0805: 4000, 1206: 2000 | N/A | |||||||||||||||||||||||||||||||||||||||
| Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm) | N/A | |||||||||||||||||||||||||||||||||||||||
| Precautions For Use | |||||||||||||||||||||||||||||||||||||||||
| Soldering Profile | Follow the temperature profile graph (refer to enclosure). | N/A | |||||||||||||||||||||||||||||||||||||||
| Manual Soldering | Handle soldering iron carefully to avoid thermal cracks. | N/A | |||||||||||||||||||||||||||||||||||||||
| Recommended Soldering Method | |||||||||||||||||||||||||||||||||||||||||
| Soldering Method | RReflow Soldering, WWave Soldering | N/A | |||||||||||||||||||||||||||||||||||||||
| Temperature Profile for Soldering | Keep temperature difference between soldering temperature and surface temperature of chips T150. | N/A | |||||||||||||||||||||||||||||||||||||||
2509251626_AIDE-CAPACITOR-0402X7R103K500NT_C48579246.pdf
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