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Specifications
Voltage Rating:
50V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0402X7R104K500NT
Model Number:
0402X7R104K500NT
Package:
0402
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These capacitors are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Testing Method | |
|---|---|---|---|
| Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits | |||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||
| Testing Conditions | |||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||
| Construction and Dimension | |||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||
| Dimension (mm) | See table below | Digital caliper | |
| Part number (British system / Metric system) | L W T WB | ||
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | ||
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | ||
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | ||
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | ||
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | ||
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | ||
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | ||
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | ||
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | ||
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | ||
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | ||
| Specification and Testing Method | |||
| 1. Temperature | -55~+125 | ||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| 3. Static Capacity | Meet standard specification and tolerance | See table below | |
| NPO characteristic: Capacity Frequency Voltage | |||
| 1000pF 1MHz10%, 1.00.2Vrms | |||
| 1000 pF 1KHz10%, 1.00.2Vrms | |||
| X7R/X7T/X7P characteristic: Capacity Frequency Voltage | |||
| 10uF 1KHz10%, 1.00.2Vrms | |||
| 10uF 120Hz24, 0.50.1Vrms | |||
| 4. Dissipation Factor (DF) | See table below | See table below | |
| 5. IR Insulation Resistance | See table below | See table below | |
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Voltage Raising time: 110S, Voltage maintaining time2S | |
| Ur=100V, 2.5 x rated voltage | |||
| Ur=200V/250V, 2.0 x rated voltage | |||
| Ur=450/500/630V, 1.5 x rated voltage | |||
| 1KVUr2KV, 1.2 x rated voltage | |||
| 2KVUr, 1.1 x rated voltage | |||
| 7. Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |
| 9. Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading; X7R :C/C15%; X7T -33% C/C22%; X7PC/C10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | |
| DF: Refer to NO#4; IR: Refer to NO#5 | |||
| 10. Flexural strength | No damage. Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Test it under the flexural status. | |
| 11. Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S | |
| 12. Thermal shock | NPO Characteristic; C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristicC/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |
| 13. Temperature moisture exposure | Visual No visual damage. Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%; DF 2 times initial standard; IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading) | Temperature 402 Humidity 90~95%RH time 500+24 hours. Test it after place 242 hours normal temp & humidity. | |
| 14. High temperature exposure | Visual No visual damage. Electrostatic capacitance change rate NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR NPO : IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading) | Temperature 1253 Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |
| 15. PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. | |
| EMBOSSED PLASTIC TAPING | |||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | See table below | ||
| Code | A B C D E F G H J | ||
| 0805 | 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | ||
| 1206 | 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 | ||
| 1210 | 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 | ||
| 1808 | 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 | ||
| 1812 | 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 | ||
| Paper tape reel packing for 10050402~12063216 | |||
| Paper tape reel packing for 100502010402 type | See table below | ||
| Code | W1 L1 D C B P1 P2 P0 d t | ||
| 1005 | 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below | ||
| 0201 | 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below | ||
| 0402 | 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below | ||
| Paper tape reel packing for 060308051206 types | See table below | ||
| Code | A B C D E F G H J | ||
| 0603 | 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | ||
| 0805 | 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | ||
| 1206 | 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | ||
| Reel Dimensions (unit: mm) | |||
| 7REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||
| 13REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||
| Taping specification | |||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping | |
| Packing quantity | |||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | ||
| 0805 | 4000 | 3000 (T1.35mm), 3000 (T1.35mm) | |
| 1206 | 2000 (T1.60mm), 3000 (T1.60mm) | ||
| 1210 | 2000 | ||
| 1808 | 1000 (T1.85mm) | ||
| 1812 | 1000 (T1.85mm) | ||
| 1812 | 800 | 500 | |
| Precautions For Use | |||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | ||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||
| Optimum Solder Amount for Reflow Soldering | Recommended | ||
| Recommended Soldering Method | |||
| Size | Temperature Characteristics | Capacitance | Soldering Method |
| 1005 | NPO, X7R/X5R/X7S/X6S | / | R |
| 0201 | NPO, X7R/X5R/X7S/X6S, Y5V | / | R |
| 0402 | NPO, X7R/X5R/X7S/X6S, Y5V | / | R |
| 0603 | NPO, X7R/X5R/X7S/X6S, Y5V | C1uf: R, C1uf: R/W | R/W |
| 0805 | NPO, X7R/X5R/X7S/X6S, Y5V | C4.7uf: R, C4.7uf: R/W (NPO), C1uf: R, C1uf: R/W (Y5V) | R/W |
| 1206 | NPO, X7R/X5R/X7S/X6S, Y5V | C10uf: R, C10uf: R/W | R/W |
| 1210 | NPO, X7R/X5R/X7S/X6S, Y5V | / | R |
| Soldering methodRReflow Soldering, WWave Soldering | |||
| The temperature profile for soldering | |||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||
2509251626_AIDE-CAPACITOR-0402X7R104K500NT_C48579249.pdf
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