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quality High voltage multilayer ceramic capacitor AIDE CAPACITOR 0603C0G120J500NT suitable for coupling wave filtering factory
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quality High voltage multilayer ceramic capacitor AIDE CAPACITOR 0603C0G120J500NT suitable for coupling wave filtering factory
>
Specifications
Voltage Rating:
50V
Capacitance:
12pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G120J500NT
Model Number:
0603C0G120J500NT
Package:
0603
Key Attributes
Product Description

Product Overview

High-voltage Multi-Layer Ceramic Capacitors (MLCCs) designed for coupling, wave filtering, and resonant applications in high-voltage circuits. These capacitors are suitable for a wide range of applications including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Compliance: RoHS/REACH compliant

Technical Specifications

Part Number Description

Example: 1812 X7R 684 M 251 N T

Item Description Details
1 Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2 Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3 Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4 Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5 Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
6 Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7 Packing T Tape/Reel, P Bag packing (PE)

Construction

Item Description
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer

Dimensions (mm)

Part Number Dimension (mm) L Dimension (mm) W Dimension (mm) T Dimension (mm) WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40

Specification and Testing Method

No Item Specification/Requirement Testing method
1 Temperature -55~+125
2 Visual/ Dimension 1,No Damage 2,Dimension meet Spec Naked eye (Visual inspection), Digital calliper
3 Static capacity Meet standard specification and tolerance
4 Dissipation factor (DF ) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
X7R/X7T/X7P characteristic: see Note 1
NPO: Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms.
X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24, 0.5V0.1rms.
5 IR Insulation Resistance NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF
X7R/X7T/X7P Characteristic : IR10000M,C25nF; IR*Cr100S,C25nF
Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
6 Hi-potDC Ur=100V,...............2.5 x rated voltage; Ur=200V/250V,.... 2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV,.......1.2 x rated voltage; 2KVUr,...............1.1 x rated voltage Voltage Raising time:110S, Voltage maintaining time2S
7 Solderability soldering area90% Pre-heating temperature 80-120,time10-30s, lead free solder, flux; Soldering temperature 2455; Solder time 20.5s
8 Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours.
9 Flexural strength No damage Base boardAl2O3 /PCB; PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec.
10 Terminal bonding strength No visual damage Applied Force: 5N Duration: 101S
11 Thermal shock NPO Characteristic; C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristic C/C10% Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity
12 Temperature moisture exposure Visual No visual damage; Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%; DF 2 times initial standard; IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading) Temperature 402 Humidity 90~95%RH time 500+24 hours; Test it after place 242 hours normal temp & humidity
13 High temperature exposure Visual No visual damage; Electrostatic capacitance change rate NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR NPO : IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading) Temperature 1253 Time 100048 hours; Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage; Test it after place 48hours under normal pressure & temperature.
14 PCB flexural strength No crack and other defect Soldering the MLCC on the PCB, Then pressing direction base on the photo.

Embossed Plastic Taping Dimensions (mm)

Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing Dimensions (mm)

Code Paper size W1 Paper size L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Paper size A Paper size B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max

Reel Dimensions (mm)

Unit:mm A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Packing Quantity

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T>1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T>1.60mm)
1812 2000
1812 1000 (T1.85mm)
800 (T>1.85mm)
500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe conditions beyond specified ratings. Following precautions and application notes are recommended.

  • Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Handle soldering irons carefully to avoid thermal cracks.
  • Optimum Solder Amount for Reflow Soldering.
  • Recommended Soldering amounts.

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering


2509251626_AIDE-CAPACITOR-0603C0G120J500NT_C48579254.pdf

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