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Specifications
Voltage Rating:
16V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0603X5R106K160NT
Model Number:
0603X5R106K160NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of standard sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Temperature Characteristic Options: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method/Conditions |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |
| Testing Conditions | Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| Part Number Description Example | 1812 X7R 684 M 251 N T | |
| Dimension Codes (L*W) | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimensions (mm) | 0201: 0.600.10 (L) x 0.300.05 (W) x 0.300.05 (T) (WB: 0.100.05) 0402: 1.000.15 (L) x 0.500.15 (W) x 0.500.10 (T) (WB: 0.200.10) 0603: 1.600.20 (L) x 0.800.15 (W) x 0.800.15 (T) (WB: 0.300.10) 0805: 2.000.20 (L) x 1.250.20 (W) x 0.800.20 (T) (WB: 0.500.20) 1206: 3.200.30 (L) x 1.600.30 (W) x 1.000.20 (T) (WB: 0.600.30) 1210: 3.200.30 (L) x 2.500.30 (W) (T2.70) (WB: 0.800.30) 1808: 4.500.40 (L) x 2.000.20 (W) (T2.70) (WB: 0.800.30) 1812: 4.500.40 (L) x 3.200.30 (W) (T3.50) (WB: 0.800.30) 1825: 4.500.40 (L) x 6.300.50 (W) (T3.50) (WB: 0.800.30) 2220: 5.700.50 (L) x 5.000.50 (W) (T3.50) (WB: 1.000.40) 2225: 5.700.50 (L) x 6.300.50 (W) (T6.20) (WB: 1.000.40) | |
| Temperature Range | -55~+125 | N/A |
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | N/A |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF) or IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF) or IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Dielectric breakdown or damage, based on rated voltage (Ur): Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90%, No Damage | Pre-heating: 80-120 (10-30s), Lead free solder, flux. Soldering: 2455 (20.5s) |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering: 2655 (51s). Cleaning with solvent. Room temperature, 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Initial capacitance testing: Pre-heating 150 (1hr), then 48hrs under normal pressure & temperature. |
| Flexural Strength | No damage. Electrostatic capacity change rate: C/C10% | Base board: Al2O3 /PCB (Thickness: 1.6mm, Length: 100mm, Width: 40mm). Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing direction based on diagram. |
| Embossed Plastic Taping Dimensions | 0805: Tape size 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max 1206: Tape size 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max 1210: Tape size 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max 1808: Tape size 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max 1812: Tape size 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max | |
| Paper Tape Reel Packing Dimensions | 1005: Papersize W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30 0201: Papersize W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80 0402: Papersize W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80 0603: Papersize A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T Max 1.10 0805: Papersize A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T Max 1.10 1206: Papersize A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T Max 1.10 | |
| Reel Dimensions | 7REEL: 1782.0 (A), 3.0 (B), 130.5 (C), 210.5 (D), 21 or Bigger (E), 1010.5 (F), 12max (G) 13REEL: 3302.0 (A), 3.0 (B), 130.5 (C), 210.5 (D), 21 or Bigger (E), 1010.5 (F), 12max (G) | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | Standard |
| Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000, 1206: 4000 Plastic T/R (Pcs): 0805: 3000 (T1.35mm), 1206: 3000 (T1.60mm) / 2000 (T>1.60mm), 1210: 2000, 1808: 1000 (T1.85mm) / 800 (T>1.85mm), 1812: 500 | |
| Soldering Method Recommendation | Sizes: 1005, 0201, 0402, 0603, 0805, 1206, 1210 Methods: RReflow Soldering, WWave Soldering (Refer to detailed table in source document for specific size/capacitance/voltage combinations) | |
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |
Note: Precautions for use include avoiding sudden temperature changes during soldering, careful manual soldering to prevent thermal cracks, and adhering to recommended soldering profiles and amounts. MLCCs may fail in short or open circuit modes under severe conditions beyond specified ratings, potentially causing burnout, flaming, or glowing.
2509251626_AIDE-CAPACITOR-0603X5R106K160NT_C48579263.pdf
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