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Specifications
Voltage Rating:
25V
Capacitance:
2.2uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0603X5R225K250NT
Model Number:
0603X5R225K250NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in a range of standard sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions: Normal condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3. Part Number Description | Item | Description | Example | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2 | Temperature characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3 | Nominal electrostatic capacity | 8R08.0, 10010, 101100 (pF) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4 | Tolerance of electrostatic capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5 | Rated voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6 | Terminal composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7 | Packing | T Tape/Reel, P Bag packing (PE) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4. Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimension (mm) |
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| 5. Specification and testing method | Temperature | -55~+125 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static capacity | NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms 1000 pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Specification and testing method | IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Specification and testing method | Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Specification and testing method | Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Specification and testing method | Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature moisture exposure | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High temperature exposure | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Charging and discharging current 50mA Max. Test after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14. PCB flexural strength | No crack and other defect | IR | Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. EMBOSSED PLASTIC TAPING | Embossed tape reel packing | 0805(2012)~1812(4532) type | See dimensions in the original document. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. EMBOSSED PLASTIC TAPING | Paper tape reel packing | 10050402~12063216 | See dimensions in the original document. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. EMBOSSED PLASTIC TAPING | Reel Dimensions | 7REEL 1782.0, 13REEL 3302.0 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. EMBOSSED PLASTIC TAPING | Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7. Packing quantity | Paper T/R (Pcs) | 0201: 4000, 0402: 4000, 0603: 4000, 0805: 4000 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7. Packing quantity | Plastic T/R (Pcs) | 0805: 3000, 1206 (T1.60mm): 3000, 1210 (T1.60mm): 2000, 1812 (T1.85mm): 1000 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 8. Precautions For Use | Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 8. Precautions For Use | Manual Soldering | Handle carefully, pay attention to soldering iron tip selection and temperature contact. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 9. Recommended Soldering Method | Size, Characteristics, Voltage, Capacitance | See table in original document. | RReflow Soldering, WWave Soldering | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 10. The temperature profile for soldering | Preheating temperature difference | T150 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2509251626_AIDE-CAPACITOR-0603X5R225K250NT_C48579266.pdf
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