Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They are suitable for medium and high voltage circuits and are available in various sizes and temperature characteristics.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Normal atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | | |
| Specification and Testing Method | ||
| Temperature | -55~+125 | Naked eye (Visual inspection) |
| Visual/Dimension | 1, No Damage 2, Dimension meet Spec | Digital calliper |
| Static Capacity | Meet standard specification and tolerance |
|
| Dissipation Factor (DF) |
|
|
| IR Insulation Resistance |
| Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452 452 |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal shock |
| Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity |
| Temperature moisture exposure |
| Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity |
| High temperature exposure |
| Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. Charging and discharging current 50mA Max. |
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB. Pressing direction base on the photo. SIZE A B C 0805(2012) 1.2 4 1.65 1206(3216) 2.2 5 2 1210(3225) 2.2 5 2.9 1812(4532) 3.5 7 3.7 2220(5750) 4.5 8 5.6 |
| Embossed Plastic Taping | ||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Code | Tapesize A | B | C | D | E | F | G | H | J | T 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing | ||
| Paper tape reel packing for 10050402~12063216 | Code | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Paper tape reel packing for 0603, 0805, 1206 types | Code | Papersize A | B | C | D | E | F | G | H | J | T 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | ||
| 7REEL | 1782.0 | 3.0 130.5 210.5 21 or Bigger 1010.5 12max |
| 13REEL | 3302.0 | 3.0 130.5 210.5 21 or Bigger 1010.5 12max |
| Taping specification | ||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping Reel type (b) Embossed Taping |
| Packing Quantity | ||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | 3000 (T1.35mm) | |
| 1210 | 2000 (T1.60mm) | |
| 1808 | 3000 (T1.60mm) | |
| 1812 | 2000 | |
| 1812 | 1000 (T1.85mm) | |
| 1000 (T1.85mm) | ||
| 800 | ||
| 500 | ||
| Precautions For Use | ||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method 1005 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R 0201 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | Y5V | / | / | R 0402 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | Y5V | / | / | R 0603 | NPO | / | / | R/W | X7R/X5R/X7S/X6S | / | C1uf | R | | | C1uf | R/W | Y5V | / | C1uf | R | | | C1uf | R/W 0805 | NPO | / | / | R/W | X7R/X5R/X7S/X6S | / | C4.7uf | R | | | C4.7uf | R/W | Y5V | / | C1uf | R | | | C1uf | R/W 1206 | NPO | / | / | R/W | X7R/X5R/X7S/X6S | / | C10uf | R | | | C10uf | R/W | Y5V | / | C10uf | R | | | C10uf | R/W 1210 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | Y5V | / | / | R Soldering method: RReflow Soldering, WWave Soldering | |
| The temperature profile for soldering | While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |
2509251626_AIDE-CAPACITOR-0603X7R101K251NT_C48579270.pdf
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