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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R101K500NT Suitable for Networking Communication Interfaces factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R101K500NT Suitable for Networking Communication Interfaces factory
>
Specifications
Voltage Rating:
50V
Capacitance:
100pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R101K500NT
Model Number:
0603X7R101K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications including coupling, wave filtering, and resonant circuits. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are available in medium and high voltage ratings.

Product Attributes

  • RoHS Compliance: Meets the standard
  • REACH Compliance: Meets the standard

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Temperature Operating Temperature -55~+125 N/A
Testing Condition (Normal) Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa N/A
2. Visual/Dimension Requirement 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
Part Number Dimension (mm)
Part numberDimension (mm)WB
0201 (0603)L: 0.600.10, W: 0.300.05, T: 0.300.050.100.05
0402 (1005)L: 1.000.15, W: 0.500.15, T: 0.500.100.200.10
0603 (1608)L: 1.600.20, W: 0.800.15, T: 0.800.150.300.10, 0.600.10
0805 (2012)L: 2.000.20, W: 1.250.20, T: 0.800.201.000.20, 0.500.20, 1.250.20, 0.800.20
1206 (3216)L: 3.200.30, W: 1.600.30, T: 1.000.201.250.20, 0.600.30, 1.600.30
1210 (3225)L: 3.200.30, W: 2.500.30, T: 2.700.800.30
1808 (4520)L: 4.500.40, W: 2.000.20, T: 2.700.800.30
1812 (4532)L: 4.500.40, W: 3.200.30, T: 3.500.800.30
1825 (4563)L: 4.500.40, W: 6.300.50, T: 3.500.800.30
2220 (5750)L: 5.700.50, W: 5.000.50, T: 3.501.000.40
2225 (5763)L: 5.700.50, W: 6.300.50, T: 6.201.000.40
N/A
3. Static Capacity Meet standard specification and tolerance
  • NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
4. Dissipation factor (DF) NPO Characteristic DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms
X7R/X7T/X7P characteristic See Note 1 Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms
5. IR Insulation Resistance NPO Characteristic IR50000M, C10nF; IR*Cr500S, C10nF Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
X7R/X7T/X7P Characteristic IR10000M, C25nF; IR*Cr100S, C25nF N/A
6. Hi-pot (DC) No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
7. Solderability Soldering area90% N/A Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s
8. Resistance to the heat of soldering No damage, soldering area90% N/A Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9. Flexural strength No damage Electro static capacity change rate: C/C10% Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec.
10. Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S N/A
11. Thermal shock Visual: No visual damage; Capacity change rate: NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% Pre-condition(X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
12. Temperature moisture exposure Visual: No visual damage; Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
13. High temperature exposure Visual: No visual damage; Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S Charging and discharging current 50mA Max. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
14. PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing direction based on the photo.

Part Number Description

Example: 1812 X7R 684 M 251 N T

  • Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
  • Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
  • Nominal Electrostatic Capacity: 8R0=8.0pF, 100=10pF, 101=100pF
  • Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
  • Rated Voltage (DC): 250=25V, 251=250V, 252=2500V
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Packing: T Tape/Reel, P Bag packing (PE)

Embossed Plastic Taping

Code Tape size (mm) A B C D E F G H J
T 08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.10
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.10
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.10
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.10
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.10

Paper Tape Reel Packing

Code Paper size (mm) W1 L1 D C B P1 P2 P0 d t
10050.24 0.020.45 0.028.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.30 BelowN/A
02010.37 0.100.67 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 BelowN/A
04020.65 0.101.15 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 BelowN/A
Code Paper size (mm) A B C D E F G H J T
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 MaxN/A
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 MaxN/A
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 MaxN/A

Reel Dimensions

Unit: mm A B C D E F G
7REEL1782.03.0130.5210.521 or Bigger1010.512max
13REEL3302.03.0130.5210.521 or Bigger1010.512max

Taping Specification

  • Top tape peeling strength (Paper Taping): 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

Packing Quantity

DimensionPaper T/R (Pcs)Plastic T/R (Pcs)
06034000-
080540003000 (T1.35mm)
1206-3000 (T>1.35mm)
1210-2000 (T1.60mm)
1808-3000 (T>1.60mm)
1812-2000
1812-1000 (T1.85mm)
-1000 (T>1.85mm)
-800
-500

Precautions For Use

MLCCs may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions.

  1. Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  2. Manual Soldering: Handle soldering irons carefully to avoid thermal cracks. Pay attention to tip selection and temperature.
  3. Optimum Solder Amount for Reflow Soldering
  4. Recommended Soldering amounts

Recommended Soldering Method

SizeTemperature CharacteristicsRated VoltageCapacitanceSoldering Method
1005NPO//R
X7R/X5R/X7S/X6S//R
0201NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0402NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0603NPO//R/W
X7R/X5R/X7S/X6S/C1ufR
/C1ufR/W
Y5V/C1ufR
/C1ufR/W
0805NPO//R/W
X7R/X5R/X7S/X6S/C4.7ufR
/C4.7ufR/W
Y5V/C1ufR
/C1ufR/W
1206NPO//R/W
X7R/X5R/X7S/X6S/C10ufR
/C10ufR/W
Y5V/C10ufR
/C10ufR/W
1210NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.


2509251626_AIDE-CAPACITOR-0603X7R101K500NT_C48579271.pdf

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