Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes (Au/Ag-Ni-Sn terminal composition).
- Certifications: ROHS/REACH compliant.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||
| Switch power supplier | |||
| AC-DC power charger | |||
| DC-DC power charger | |||
| Networking/Communication interface | |||
| LCD backlight unit power supplier | |||
| Amperite of energy saving lamps | |||
| Medium and High voltage MLCC | |||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | (For data not matching testing specification) | |
| Specification and Testing Method | Temperature | -55~+125 | N/A |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance | See detailed specifications in document | |
| Dissipation Factor (DF) | See detailed specifications in document | See detailed specifications in document | |
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | See detailed specifications in document (based on rated voltage) | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage; Capacitance change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage; Capacitance change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T | ||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See detailed dimensions in document | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | N/A |
| Nominal Electrostatic Capacity | 8R0=8.0, 100=10, 101=100 (pF) | N/A | N/A |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | N/A |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | N/A | N/A |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A | N/A |
| Packing | T: Tape/Reel, P: Bag packing (PE) | N/A | N/A |
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer | N/A | N/A |
| Dimensions (mm) | See detailed table in document | British system, Metric system | N/A |
| Embossed Plastic Taping | See detailed dimensions in document for 0805 to 1812 types | N/A | N/A |
| Paper Tape Reel Packing | See detailed dimensions in document for 1005, 0201, 0402, 0603, 0805, 1206 types | N/A | N/A |
| Reel Dimensions | 7REEL: 1782.0, 13REEL: 3302.0 | N/A | N/A |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | N/A | N/A |
| Packing Quantity | See detailed table in document for Paper T/R and Plastic T/R | N/A | N/A |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | See detailed table in document based on size, characteristics, voltage, and capacitance | N/A |
| Soldering Temperature Profile | Preheating temperature difference T150 | N/A | N/A |
2509251626_AIDE-CAPACITOR-0603X7R105K160NT_C48579282.pdf
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