Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. Available in a range of sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance under specified conditions.
Product Attributes
- Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Codes and Sizes
| Code | L*W (inch) | L*W (mm) |
|---|---|---|
| 0201 | 0.02*0.01 | 0.50*0.25 |
| 0402 | 0.04*0.02 | 1.00*0.50 |
| 0603 | 0.06*0.03 | 1.60*0.80 |
| 0805 | 0.08*0.05 | 2.00*1.25 |
| 1206 | 0.12*0.06 | 3.20*1.60 |
| 1210 | 0.12*0.10 | 3.20*2.50 |
| 1808 | 0.18*0.08 | 4.50*2.00 |
| 1812 | 0.18*0.12 | 4.50*3.20 |
| 1825 | 0.18*0.25 | 4.50*6.30 |
| 2211 | 0.22*0.11 | 5.70*2.80 |
| 2225 | 0.22*0.25 | 5.70*6.30 |
Construction
| Item | Description |
|---|---|
| 1 | Ceramic dielectric |
| 2 | Inner electrode |
| 3 | Outer electrode |
| 4 | Nickle layer |
| 5 | Tin layer |
Dimensions (mm)
| Part Number | Dimension (mm) L | Dimension (mm) W | Dimension (mm) T | Dimension (mm) WB |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Specifications and Testing Methods
| No. | Item | Specification/Requirement | Testing method |
|---|---|---|---|
| 1 | Temperature | -55~+125 | - |
| 2 | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3 | Static capacity | Meet standard specification and tolerance |
|
| 4 | Dissipation factor (DF) |
| - |
| 5 | IR Insulation Resistance |
| - |
| 6 | Hi-pot (DC) |
| No dielectric breakdown or damage |
| 7 | Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 9 | Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11 | Thermal shock |
| Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| 12 | Temperature moisture exposure |
| Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| 13 | High temperature exposure |
| Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. |
| 14 | PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. IR |
Packing Quantities
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T1.60mm), 2000 (T>1.60mm) |
| 1210 | - | 3000 (T1.60mm), 2000 (T>1.60mm) |
| 1808 | - | 1000 (T1.85mm), 800 (T>1.85mm) |
| 1812 | - | 1000 (T1.85mm), 500 (T>1.85mm) |
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Precautions for Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To avoid such failures, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to avoid thermal cracks. Ensure the soldering iron tip is carefully handled and appropriate for the task.
- Optimum Solder Amount for Reflow Soldering.
- Recommended Soldering amounts.
2509251626_AIDE-CAPACITOR-0603X7R123K101NT_C48579287.pdf
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