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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R123K101NT for High Voltage Power Supply Circuits factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R123K101NT for High Voltage Power Supply Circuits factory
>
Specifications
Voltage Rating:
100V
Capacitance:
12nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R123K101NT
Model Number:
0603X7R123K101NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. Available in a range of sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance under specified conditions.

Product Attributes

  • Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Packing Options: Tape/Reel (T), Bag packing (P)
  • Compliance: ROHS/REACH compliant

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

Dimension Codes and Sizes

Code L*W (inch) L*W (mm)
0201 0.02*0.01 0.50*0.25
0402 0.04*0.02 1.00*0.50
0603 0.06*0.03 1.60*0.80
0805 0.08*0.05 2.00*1.25
1206 0.12*0.06 3.20*1.60
1210 0.12*0.10 3.20*2.50
1808 0.18*0.08 4.50*2.00
1812 0.18*0.12 4.50*3.20
1825 0.18*0.25 4.50*6.30
2211 0.22*0.11 5.70*2.80
2225 0.22*0.25 5.70*6.30

Construction

Item Description
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer

Dimensions (mm)

Part Number Dimension (mm) L Dimension (mm) W Dimension (mm) T Dimension (mm) WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40

Specifications and Testing Methods

No. Item Specification/Requirement Testing method
1 Temperature -55~+125 -
2 Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
3 Static capacity Meet standard specification and tolerance
  • NPO: 1000pF 1MHz10%, 1.00.2Vrms; >1000pF 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P: 10uF 1KHz10%, 1.00.2Vrms; >10uF 120Hz24, 0.50.1Vrms
4 Dissipation factor (DF)
  • NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms.
  • X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms.
-
5 IR Insulation Resistance
  • NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
  • X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF
-
6 Hi-pot (DC)
  • Ur=100V, 2.5 x rated voltage
  • Ur=200V/250V, 2.0 x rated voltage
  • Ur=450/500/630V, 1.5 x rated voltage
  • 1KVUr2KV, 1.2 x rated voltage
  • 2KVUr, 1.1 x rated voltage
  • Voltage Raising time: 110S, Voltage maintaining time2S
No dielectric breakdown or damage
7 Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8 Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9 Flexural strength No damage. Electro static capacity change rate C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
10 Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
11 Thermal shock
  • NPO: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P: C/C0.5%
  • X7T: C/C10%
Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12 Temperature moisture exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%
  • DF: 2 times initial standard
  • IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
13 High temperature exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature.
14 PCB flexural strength No crack and other defect Soldering the MLCC on the PCB, then pressing direction based on the photo. IR

Packing Quantities

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T1.60mm), 2000 (T>1.60mm)
1210 - 3000 (T1.60mm), 2000 (T>1.60mm)
1808 - 1000 (T1.85mm), 800 (T>1.85mm)
1812 - 1000 (T1.85mm), 500 (T>1.85mm)

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
/ C1uf R/W
Y5V / C1uf R
/ C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
/ C4.7uf R/W
Y5V / C1uf R
/ C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
/ C10uf R/W
Y5V / C10uf R
/ C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Precautions for Use

Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To avoid such failures, adhere to the following precautions:

  • Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to avoid thermal cracks. Ensure the soldering iron tip is carefully handled and appropriate for the task.
  • Optimum Solder Amount for Reflow Soldering.
  • Recommended Soldering amounts.

2509251626_AIDE-CAPACITOR-0603X7R123K101NT_C48579287.pdf

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