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Specifications
Voltage Rating:
50V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R224K500NT
Model Number:
0603X7R224K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling | High voltage circuits | |||
| Wave Filtering | High voltage circuits | ||||
| Resonant | High voltage circuits | ||||
| Power Supplies | Switch power supplier, AC-DC power charger, DC-DC power charger, LCD backlight unit power supplier | ||||
| Other | Networking/Communication interface, amperite of energy saving lamps | ||||
| Testing Conditions | Normal: | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative: | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Initial Capacitance Testing: | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | ||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| Specification and Testing Method | Temperature Range | -55~+125 | N/A | ||
| Visual/Dimension | No Damage, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10% @ 1.00.2Vrms (1000pF), 1KHz10% @ 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10% @ 1.00.2Vrms (10uF), 120Hz24 @ 0.50.1Vrms (>10uF) | |||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10% @ 1V0.2rms (Cr1000pF), 1KHz10% @ 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10% @ 1V0.1rms (Cr10uF), 120Hz24 @ 0.5V0.1rms (Cr10uF) | |||
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5x rated voltage; Ur=200V/250V: 2.0x rated voltage; Ur=450/500/630V: 1.5x rated voltage; 1KVUr2KV: 1.2x rated voltage; 2KVUr: 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | |||
| Solderability | Soldering area90%, No Damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Environmental Testing | Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles, testing after 242 hours at normal temp & humidity. | ||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours at normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR measurement after soldering MLCC on PCB. Pressing direction based on provided diagrams (SIZE A, B, C values for different MLCC sizes). | |||
| Taping Specifications | Embossed Plastic Taping | Dimensions for 0805 to 1812 types (Tape size, A, B, C, D, E, F, G, H, J, T) | Details provided for various sizes (e.g., 0805, 1206, 1210, 1808, 1812). | ||
| Paper Tape Reel Packing | Dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types (Papersize W1, L1, D, C, B, P1, P2, P0, d, t and A, B, C, D, E, F, G, H, J, T) | Details provided for various sizes. | |||
| Reel Dimensions | 7' REEL, 13' REEL | Diameter, Width, Hole Diameter specifications provided. | |||
| Top Tape Peeling Strength | Paper Taping: 0.1N < peeling strength < 0.7N. Embossed Taping: Standard values provided. | No paper dirty remains on the scotch when peeling. | |||
| Packing Quantity | Paper T/R (Pcs), Plastic T/R (Pcs) | Quantities vary by MLCC size and type (e.g., 0603 Paper T/R: 4000 Pcs, 0805 Plastic T/R: 3000 Pcs). | |||
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering | Recommended methods for different MLCC sizes, temperature characteristics, rated voltage, and capacitance. | |||
| Soldering Temperature Profile | T150 (temperature difference between soldering temperature and surface temperature of chips during preheating) | Details provided for keeping temperature difference. |
Note 1: X7R/X5R/X6S/X7S/Y5V DF exceptions are detailed in the provided table based on rated voltage and capacitance values.
Precautions for Use: MLCCs may fail under severe electrical or mechanical stress. Follow soldering profiles, handle with care during manual soldering, and use optimum solder amounts to avoid cracks and ensure reliability.
2509251626_AIDE-CAPACITOR-0603X7R224K500NT_C48579296.pdf
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