Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available for medium and high voltage requirements.
Product Attributes
- Material: Ceramic dielectric, inner electrode, outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Dimension Code | 0201 | 0.02" x 0.01" (0.50mm x 0.25mm) |
| 0402 | 0.04" x 0.02" (1.00mm x 0.50mm) | |
| 0603 | 0.06" x 0.03" (1.60mm x 0.80mm) | |
| 0805 | 0.08" x 0.05" (2.00mm x 1.25mm) | |
| 1206 | 0.12" x 0.06" (3.20mm x 1.60mm) | |
| 1210 | 0.12" x 0.10" (3.20mm x 2.50mm) | |
| 1808 | 0.18" x 0.08" (4.50mm x 2.00mm) | |
| 1812 | 0.18" x 0.12" (4.50mm x 3.20mm) | |
| 1825 | 0.18" x 0.25" (4.50mm x 6.30mm) | |
| 2211 | 0.22" x 0.11" (5.70mm x 2.8mm) | |
| 2225 | 0.22" x 0.25" (5.70mm x 6.30mm) | |
| Temperature Characteristic | C0G | 0 30 PPM/ |
| X7R | 15% | |
| X5R | 15% | |
| Nominal Electrostatic Capacity | Example | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF |
| Tolerance of Electrostatic Capacity | Codes | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% |
| Rated Voltage (DC) | Codes | 250 = 25V, 251 = 250V, 252 = 2500V |
| Terminal Composition | Layering | Au/Ag-Ni-Sn (from inside out) |
| Packing | Codes | T: Tape/Reel, P: Bag packing (PE) |
| Operating Temperature Range | -55 to +125 | |
| Testing Conditions (Normal) | Temperature | 15 to 35 |
| Humidity | 45% to 75% RH | |
| Atmosphere | 86 to 106 kPa | |
| Testing Conditions (Relative) | Temperature | 25 2 |
| Humidity | 60% to 70% RH | |
| Atmosphere | 86 to 106 kPa | |
| Construction | Layers | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer |
| Dimensions (mm) | 0603 (0201) | L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05 |
| 1005 (0402) | L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10 | |
| 1608 (0603) | L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10 | |
| 2012 (0805) | L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 0.500.20 | |
| 3216 (1206) | L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 0.600.30 | |
| 3225 (1210) | L: 3.200.30, W: 2.500.30, T: 2.70, WB: 0.800.30 | |
| 4520 (1808) | L: 4.500.40, W: 2.000.20, T: 2.70, WB: 0.800.30 | |
| 4532 (1812) | L: 4.500.40, W: 3.200.30, T: 3.50, WB: 0.800.30 | |
| 4563 (1825) | L: 4.500.40, W: 6.300.50, T: 3.50, WB: 0.800.30 | |
| 5750 (2220) | L: 5.700.50, W: 5.000.50, T: 3.50, WB: 1.000.40 | |
| 5763 (2225) | L: 5.700.50, W: 6.300.50, T: 6.20, WB: 1.000.40 | |
| Dissipation Factor (DF) | NPO Characteristic | DF 0.56 (Cr < 5pF); DF 1.5[(150/Cr)+7]10 (5pF Cr < 50pF); DF 0.15% (50pF Cr) |
| X7R/X7T/X7P Characteristic | Refer to Note 1 | |
| Insulation Resistance (IR) | NPO Characteristic | IR 50000M (C 10nF); IR*Cr 500 S (C > 10nF) |
| X7R/X7T/X7P Characteristic | IR 10000M (C 25nF); IR*Cr 100 S (C > 25nF) | |
| Hi-pot (DC) | Test Voltage | 1.1x to 2.5x rated voltage depending on rated voltage (Ur) |
| Solderability | Soldering Area | 90% |
| Resistance to the heat of soldering | Visual | No damage, soldering area 90% |
| Flexural Strength | Capacitance Change Rate | |C/C| 10% |
| Terminal Bonding Strength | Applied Force | 5N |
| Thermal Shock | Capacitance Change Rate | NPO: |C/C| 2.5% or 0.25pF; X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10% |
| Temperature Moisture Exposure | Capacitance Change Rate | NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 10% |
| DF | 2 times initial standard | |
| IR | NPO: IR 2500M or IR*Cr 25S; X7R/X7T/X7P: IR 1000M or IR*Cr 25S | |
| High Temperature Exposure | Capacitance Change Rate | NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 20% |
| DF | 2 x initial standard | |
| IR | NPO: IR 4000M or IR*Cr 40S; X7R/X7T/X7P: IR 2000M or IR*Cr 50S | |
| PCB Flexural Strength | Defect check | No crack and other defects |
| Embossed Plastic Taping Dimensions (mm) | 0805 | Tape size: 1.550.20, A: 2.350.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.50 Max |
| 1206 | Tape size: 1.950.20, A: 3.600.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.85 Max | |
| 1210 | Tape size: 2.700.10, A: 3.420.10, B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 3.2 Max | |
| 1808 | Tape size: 2.200.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 3.0 Max | |
| 1812 | Tape size: 3.660.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 8.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | 1005 | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: Below 0.30 |
| 0201 | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: Below 0.80 | |
| 0402 | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: Below 0.80 | |
| 0603 | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| 0805 | A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| 1206 | A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| Reel Dimensions (mm) | 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max |
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N |
| Packing Quantity | See table on Page 11 |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can lead to burnout, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Recommended Soldering Method: See table on Page 13.
- Soldering Temperature Profile: Maintain a temperature difference (T) of 150 between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-0603X7R471K251NT_C48579303.pdf
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