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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R471K251NT for High Voltage Power Supply Circuits factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R471K251NT for High Voltage Power Supply Circuits factory
>
Specifications
Voltage Rating:
250V
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R471K251NT
Model Number:
0603X7R471K251NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available for medium and high voltage requirements.

Product Attributes

  • Material: Ceramic dielectric, inner electrode, outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification
Dimension Code 0201 0.02" x 0.01" (0.50mm x 0.25mm)
0402 0.04" x 0.02" (1.00mm x 0.50mm)
0603 0.06" x 0.03" (1.60mm x 0.80mm)
0805 0.08" x 0.05" (2.00mm x 1.25mm)
1206 0.12" x 0.06" (3.20mm x 1.60mm)
1210 0.12" x 0.10" (3.20mm x 2.50mm)
1808 0.18" x 0.08" (4.50mm x 2.00mm)
1812 0.18" x 0.12" (4.50mm x 3.20mm)
1825 0.18" x 0.25" (4.50mm x 6.30mm)
2211 0.22" x 0.11" (5.70mm x 2.8mm)
2225 0.22" x 0.25" (5.70mm x 6.30mm)
Temperature Characteristic C0G 0 30 PPM/
X7R 15%
X5R 15%
Nominal Electrostatic Capacity Example 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF
Tolerance of Electrostatic Capacity Codes B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
Rated Voltage (DC) Codes 250 = 25V, 251 = 250V, 252 = 2500V
Terminal Composition Layering Au/Ag-Ni-Sn (from inside out)
Packing Codes T: Tape/Reel, P: Bag packing (PE)
Operating Temperature Range -55 to +125
Testing Conditions (Normal) Temperature 15 to 35
Humidity 45% to 75% RH
Atmosphere 86 to 106 kPa
Testing Conditions (Relative) Temperature 25 2
Humidity 60% to 70% RH
Atmosphere 86 to 106 kPa
Construction Layers Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
Dimensions (mm) 0603 (0201) L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05
1005 (0402) L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10
1608 (0603) L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10
2012 (0805) L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 0.500.20
3216 (1206) L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 0.600.30
3225 (1210) L: 3.200.30, W: 2.500.30, T: 2.70, WB: 0.800.30
4520 (1808) L: 4.500.40, W: 2.000.20, T: 2.70, WB: 0.800.30
4532 (1812) L: 4.500.40, W: 3.200.30, T: 3.50, WB: 0.800.30
4563 (1825) L: 4.500.40, W: 6.300.50, T: 3.50, WB: 0.800.30
5750 (2220) L: 5.700.50, W: 5.000.50, T: 3.50, WB: 1.000.40
5763 (2225) L: 5.700.50, W: 6.300.50, T: 6.20, WB: 1.000.40
Dissipation Factor (DF) NPO Characteristic DF 0.56 (Cr < 5pF); DF 1.5[(150/Cr)+7]10 (5pF Cr < 50pF); DF 0.15% (50pF Cr)
X7R/X7T/X7P Characteristic Refer to Note 1
Insulation Resistance (IR) NPO Characteristic IR 50000M (C 10nF); IR*Cr 500 S (C > 10nF)
X7R/X7T/X7P Characteristic IR 10000M (C 25nF); IR*Cr 100 S (C > 25nF)
Hi-pot (DC) Test Voltage 1.1x to 2.5x rated voltage depending on rated voltage (Ur)
Solderability Soldering Area 90%
Resistance to the heat of soldering Visual No damage, soldering area 90%
Flexural Strength Capacitance Change Rate |C/C| 10%
Terminal Bonding Strength Applied Force 5N
Thermal Shock Capacitance Change Rate NPO: |C/C| 2.5% or 0.25pF; X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10%
Temperature Moisture Exposure Capacitance Change Rate NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 10%
DF 2 times initial standard
IR NPO: IR 2500M or IR*Cr 25S; X7R/X7T/X7P: IR 1000M or IR*Cr 25S
High Temperature Exposure Capacitance Change Rate NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 20%
DF 2 x initial standard
IR NPO: IR 4000M or IR*Cr 40S; X7R/X7T/X7P: IR 2000M or IR*Cr 50S
PCB Flexural Strength Defect check No crack and other defects
Embossed Plastic Taping Dimensions (mm) 0805 Tape size: 1.550.20, A: 2.350.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.50 Max
1206 Tape size: 1.950.20, A: 3.600.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.85 Max
1210 Tape size: 2.700.10, A: 3.420.10, B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 3.2 Max
1808 Tape size: 2.200.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 3.0 Max
1812 Tape size: 3.660.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 8.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 4.0 Max
Paper Tape Reel Packing Dimensions (mm) 1005 W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: Below 0.30
0201 W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: Below 0.80
0402 W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: Below 0.80
0603 A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max
0805 A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max
1206 A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max
Reel Dimensions (mm) 7' REEL 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13' REEL 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
Top Tape Peeling Strength Standard 0.1N < peeling strength < 0.7N
Packing Quantity See table on Page 11

Precautions for Use

Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can lead to burnout, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling precautions.

  • Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
  • Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
  • Recommended Soldering Method: See table on Page 13.
  • Soldering Temperature Profile: Maintain a temperature difference (T) of 150 between soldering temperature and chip surface temperature during preheating.

2509251626_AIDE-CAPACITOR-0603X7R471K251NT_C48579303.pdf

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