<
>
Specifications
Voltage Rating:
50V
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R471K500NT
Model Number:
0603X7R471K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | High voltage circuits: Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |
| Functions: Coupling, wave filtering, resonant. | ||
| Testing Condition | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction | Item | Description |
| 1 | Ceramic dielectric | |
| 2 | Inner electrode | |
| 3 | Outer electrode | |
| 4 | Nickle layer | |
| 5 | Tin layer | |
| Dimension (mm) | Part Number | L W T WB |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |
| Specification and Testing Method | Temperature | -55~+125 |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms; Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. (See Note 1 for exceptions) | |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | |
| Solderability | Soldering area90%. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10% | |
| Terminal bonding strength | No visual damage. Applied Force: 5N. Duration: 101S. | |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10%. Run 5 cycles. Test after place 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual No visual damage. Temperature 402, Humidity 90~95%RH, time 50024 hours. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | |
| High temperature exposure | Visual No visual damage. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | |
| PCB flexural strength | No crack and other defect. IR. | |
Packaging
| Type | Size | A | B | C | D | E | F | G | H | J | T | Packing Quantity (Pcs) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Embossed Plastic Taping | 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | 3000 (T1.35mm) |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | 3000 (T1.60mm) | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | 2000 (T1.60mm) / 3000 (T>1.60mm) | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | 2000 | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | 1000 (T1.85mm) / 800 (T>1.85mm) | |
| Paper Tape Reel Packing | 1005 (0402) | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | 4000 (0603, 0805) |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | 4000 (0603, 0805) | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | 4000 (0603, 0805) | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | 4000 (1206) | |
| Reel Dimensions | 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully, and select appropriate tips and temperatures.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603X7R471K500NT_C48579304.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
