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quality Ceramic capacitor AIDE CAPACITOR 0805C0G101J101NT suitable for AC DC power chargers and switch mode power supplies factory
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quality Ceramic capacitor AIDE CAPACITOR 0805C0G101J101NT suitable for AC DC power chargers and switch mode power supplies factory
>
Specifications
Voltage Rating:
100V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G101J101NT
Model Number:
0805C0G101J101NT
Package:
0805
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions within various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are suitable for medium and high voltage requirements.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • RoHS/REACH Compliance: Meets RoHS and REACH standards.

Technical Specifications

Item Description/Specification Testing Method
General Conditions
Testing Condition (Normal) Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa N/A
Testing Condition (Relative) Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa N/A
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code
  • 0201 (0.02*0.01 inch / 0.50*0.25 mm)
  • 0402 (0.04*0.02 inch / 1.00*0.50 mm)
  • 0603 (0.06*0.03 inch / 1.60*0.80 mm)
  • 0805 (0.08*0.05 inch / 2.00*1.25 mm)
  • 1206 (0.12*0.06 inch / 3.20*1.60 mm)
  • 1210 (0.12*0.10 inch / 3.20*2.50 mm)
  • 1808 (0.18*0.08 inch / 4.50*2.00 mm)
  • 1812 (0.18*0.12 inch / 4.50*3.20 mm)
  • 1825 (0.18*0.25 inch / 4.50*6.30 mm)
  • 2211 (0.22*0.11 inch / 5.70*2.8 mm)
  • 2225 (0.22*0.25 inch / 5.70*6.30 mm)
 N/A
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) N/A
3. Nominal Electrostatic Capacity 8R0 = 8.0 pF, 100 = 10 pF, 101 = 100 pF N/A
4. Tolerance of Electrostatic Capacity B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% N/A
5. Rated Voltage (DC) 250 = 25V, 251 = 250V, 252 = 2500V N/A
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out) N/A
7. Packing T = Tape/Reel, P = Bag packing (PE) N/A
Construction and Dimension
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer N/A
Dimension (mm)
Part NumberDimension (L)Dimension (W)Dimension (T)WB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.200.500.20
1206 (3216)3.200.301.600.301.000.200.600.30
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
N/A
Specification and Testing Method
1. Temperature -55~+125 N/A
2. Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
3. Static Capacity Meet standard specification and tolerance
  • NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
4. Dissipation Factor (DF)
  • NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms
  • NPO: Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms
  • X7R/X7T/X7P: See Note 1
5. IR Insulation Resistance
  • NPO: IR50000M, C10nF; IR*Cr500S, C10nF
  • X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF
 Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6. Hi-pot (DC) Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S
7. Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8. Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9. Flexural Strength No damage. Electro static capacity change rate: C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec.
10. Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
11. Thermal Shock
  • NPO: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P: C/C0.5%
  • X7T: -33% C/C22%
 5 cycles thermal shock. Test after 242 hours normal temp & humidity.
12. Temperature Moisture Exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%
  • DF: 2 times initial standard
  • IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity.
13. High Temperature Exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours normal pressure & temperature.
14. PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing direction based on the photo.
Embossed Plastic Taping
Taping Specification
  • 0805: A=1.550.20, B=2.350.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.50 Max
  • 1206: A=1.950.20, B=3.600.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.1, J=1.50 -0/+0.10, T=1.85 Max
  • 1210: A=2.700.10, B=3.420.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=3.2 Max
  • 1808: A=2.200.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.50 -0/+0.10, T=3.0 Max
  • 1812: A=3.660.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=8.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=4.0 Max
 N/A
Paper Tape Reel Packing
Taping Specification
  • 1005: W1=0.240.02, L1=0.450.02, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.30 Below
  • 0201: W1=0.370.10, L1=0.670.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below
  • 0402: W1=0.650.10, L1=1.150.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below
  • 0603: A=1.100.10, B=1.900.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max
  • 0805: A=1.450.15, B=2.300.15, C=8.00.15, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max
  • 1206: A=1.800.20, B=3.400.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max
 N/A
Reel Dimensions 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. N/A
Top tape peeling strength 0.1N < peeling strength < 0.7N N/A
Packing Quantity
  • Paper T/R: 0603(4000), 0805(4000), 1206(4000)
  • Plastic T/R: 0805(3000), 1206(3000), 1210(2000), 1808(2000), 1812(1000)
 N/A
Precautions For Use
Soldering Profile Follow the temperature profile in the adjacent graph. Refer to the graph in the enclosure page.
Manual Soldering Handle carefully, pay attention to soldering iron tip selection and temperature contact. N/A
Recommended Soldering Method RReflow Soldering, WWave Soldering See Page 13 for size-specific recommendations.
Soldering Temperature Profile While preheating, keep temperature difference between soldering temperature and surface temperature of chips T150. N/A

2509251626_AIDE-CAPACITOR-0805C0G101J101NT_C48579313.pdf

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