Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from inside out).
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | ||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||
| Dimensions (mm) | Part Number | L (max) | W (max) | T (max) | WB (max) |
| 0201 (0603) | 0.70 | 0.40 | 0.40 | 0.20 | |
| 0402 (1005) | 1.15 | 0.65 | 0.60 | 0.30 | |
| 0603 (1608) | 1.80 | 0.95 | 0.95 | 0.40 | |
| 0805 (2012) | 2.20 | 1.45 | 1.05 | 0.50 | |
| 1206 (3216) | 3.50 | 1.80 | 1.20 | 0.70 | |
| 1210 (3225) | 3.50 | 2.70 | 1.00 | 0.80 | |
| 1808 (4520) | 4.70 | 2.20 | 1.00 | 0.80 | |
| 1812 (4532) | 4.70 | 3.40 | 1.00 | 0.80 | |
| 1825 (4563) | 4.70 | 6.50 | 1.00 | 0.80 | |
| 2220 (5750) | 5.90 | 5.20 | 1.20 | 1.00 | |
| 2225 (5763) | 5.90 | 6.50 | 1.20 | 1.00 | |
| PCB flexural strength (A, B, C in mm) | 0805(2012): 1.2, 4, 1.65 1206(3216): 2.2, 5, 2 1210(3225): 2.2, 5, 2.9 1812(4532): 3.5, 7, 3.7 2220(5750): 4.5, 8, 5.6 | ||||
| Specifications & Testing Methods | Temperature | -55~+125 | |||
| Visual/Dimension | No Damage, Dimension meet Spec | ||||
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions) | ||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF (Testing condition: Rated voltage, 605s, Humidity75%, Temp: 255, Current 50mA) | ||||
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage (Voltage Raising time: 110S, Voltage maintaining time: 2S) | ||||
| Solderability | Soldering area90% (Visual-No damage) | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | ||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | ||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | ||||
| Terminal Bonding Strength | No visual damage (Applied Force: 5N, Duration: 101S) | ||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | ||||
| Temperature Moisture Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% | ||||
| High Temperature Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% | ||||
| PCB Flexural Strength | No crack and other defect | ||||
| Packing | Embossed Plastic Taping | Details for 0805 to 1812 types (Tape size A, B, C, D, E, F, G, H, J, T) | |||
| Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size W1, L1, D, C, B, P1, P2, P0, d, t) | ||||
| Reel Dimensions | 7REEL (1782.0), 13REEL (3302.0) | ||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | ||||
| Packing Quantity | See Page 11 for details based on size and packing type (Paper T/R, Plastic T/R). | ||||
| Precautions for Use | MLCCs may fail short circuit mode under severe electrical/mechanical stress. Follow soldering profiles, handle with care during manual soldering, and ensure optimum solder amount for reflow. Refer to adjacent graphs and application notes. | ||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristics, rated voltage, and capacitance. | ||||
2509251626_AIDE-CAPACITOR-0805C0G221J500NT_C48579571.pdf
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