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quality High Voltage Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805C0G221J500NT for Power Supply Circuits factory
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quality High Voltage Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805C0G221J500NT for Power Supply Circuits factory
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Specifications
Voltage Rating:
50V
Capacitance:
220pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G221J500NT
Model Number:
0805C0G221J500NT
Package:
0805
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out).
  • RoHS/REACH Compliance: Meets RoHS and REACH standards.

Technical Specifications

Item Description/Specification Details
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier
AC-DC power charger
DC-DC power charger
Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC)
Testing Conditions Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Initial Capacitance Testing Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature.
Part Number Description Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R0=8.0pF, 100=10pF, 101=100pF
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250=25V, 251=250V, 252=2500V
Terminal Composition Au/Ag-Ni-Sn (From the inside out)
Packing T (Tape/Reel), P (Bag packing)
Dimensions (mm) Part Number L (max) W (max) T (max) WB (max)
0201 (0603) 0.70 0.40 0.40 0.20
0402 (1005) 1.15 0.65 0.60 0.30
0603 (1608) 1.80 0.95 0.95 0.40
0805 (2012) 2.20 1.45 1.05 0.50
1206 (3216) 3.50 1.80 1.20 0.70
1210 (3225) 3.50 2.70 1.00 0.80
1808 (4520) 4.70 2.20 1.00 0.80
1812 (4532) 4.70 3.40 1.00 0.80
1825 (4563) 4.70 6.50 1.00 0.80
2220 (5750) 5.90 5.20 1.20 1.00
2225 (5763) 5.90 6.50 1.20 1.00
PCB flexural strength (A, B, C in mm) 0805(2012): 1.2, 4, 1.65
1206(3216): 2.2, 5, 2
1210(3225): 2.2, 5, 2.9
1812(4532): 3.5, 7, 3.7
2220(5750): 4.5, 8, 5.6
Specifications & Testing Methods Temperature -55~+125
Visual/Dimension No Damage, Dimension meet Spec
Static Capacity NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Dissipation Factor (DF) NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions)
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C10nF
X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF (Testing condition: Rated voltage, 605s, Humidity75%, Temp: 255, Current 50mA)
Hi-pot (DC) Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage (Voltage Raising time: 110S, Voltage maintaining time: 2S)
Solderability Soldering area90% (Visual-No damage)
Resistance to the heat of soldering Visual-No damage, soldering area90%
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%
Flexural Strength No damage. Electro static capacity change rate C/C10%
Terminal Bonding Strength No visual damage (Applied Force: 5N, Duration: 101S)
Thermal Shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10%
Temperature Moisture Exposure NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%
High Temperature Exposure NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%
PCB Flexural Strength No crack and other defect
Packing Embossed Plastic Taping Details for 0805 to 1812 types (Tape size A, B, C, D, E, F, G, H, J, T)
Paper Tape Reel Packing Details for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size W1, L1, D, C, B, P1, P2, P0, d, t)
Reel Dimensions 7REEL (1782.0), 13REEL (3302.0)
Top Tape Peeling Strength 0.1N < peeling strength < 0.7N
Packing Quantity See Page 11 for details based on size and packing type (Paper T/R, Plastic T/R).
Precautions for Use MLCCs may fail short circuit mode under severe electrical/mechanical stress. Follow soldering profiles, handle with care during manual soldering, and ensure optimum solder amount for reflow. Refer to adjacent graphs and application notes.
Recommended Soldering Method RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristics, rated voltage, and capacitance.

2509251626_AIDE-CAPACITOR-0805C0G221J500NT_C48579571.pdf

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