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Specifications
Voltage Rating:
100V
Capacitance:
33pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G330J101NT
Model Number:
0805C0G330J101NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonance in various power supply circuits. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, meeting stringent testing conditions and offering reliable performance.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | ||
| Testing Condition: Normal Condition (Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa) | |||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Nominal Electrostatic Capacity | Example | 8R08.0, 10010, 101100 (pF) | N/A |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A |
| Rated Voltage (DC) | Example | 250 25, 251 250, 252 2500 (V) | N/A |
| Packing | Code | T Tape/Reel, P Bag packing (PE) | N/A |
| Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | N/A |
| Dimension (mm) | Part Number, L, W, T, WB | See table on Page 2 | Digital Calliper |
| Temperature Characteristic | -55~+125 | N/A | |
| Static Capacity | Meet standard specification and tolerance | Frequency, Voltage dependent (See Page 3 for details) | |
| Dissipation Factor (DF) | See Page 3 for details | Frequency, Voltage dependent | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | Visual |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF larger reading; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | N/A |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | Visual |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | N/A |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | N/A |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | N/A |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | N/A |
| PCB Flexural Strength | No crack and other defect | See Page 7 for dimensions (A, B, C) for different sizes. | IR |
| Embossed Plastic Taping | Taping Specification | See Page 8 for dimensions (A, B, C, D, E, F, G, H, J, T) for different sizes. | N/A |
| Paper Tape Reel Packing | Taping Specification | See Page 9 for dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for different sizes. | N/A |
| Reel Dimensions | 7REEL, 13REEL | See Page 10 for dimensions (A, B, C, D, E, F, G) | N/A |
| Top Tape Peeling Strength | Paper Taping, Embossed Taping | 0.1N < peeling strength < 0.7N | N/A |
| Packing Quantity | Paper T/R (Pcs), Plastic T/R (Pcs) | See Page 11 for quantities by size. | N/A |
| Soldering Method | RReflow Soldering, WWave Soldering | See Page 13 for recommended methods by size, characteristic, rated voltage, and capacitance. | N/A |
| Soldering Temperature Profile | See Page 14 for temperature profile details. Keep temperature difference T150. | N/A | |
2509251626_AIDE-CAPACITOR-0805C0G330J101NT_C48579573.pdf
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