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Specifications
Voltage Rating:
630V
Capacitance:
47pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G470J631NT
Model Number:
0805C0G470J631NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs offer reliable performance across a range of operating conditions and are available in various sizes and specifications to meet diverse application needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | High voltage circuits: coupling, wave filtering, resonant. Applications include switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy saving lamps. (Medium and High voltage MLCC) | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 3. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic (C0G, X7R, X5R) Nominal electrostatic capacity (pF) Tolerance of electrostatic capacity (B, C, D, F, G, J, K, M, Z) Rated voltage (DC) (V) Terminal composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag) | ||
| 4. Construction and Dimension | Construction: | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | |
| Dimension (mm): | Part number | L W T WB | |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | ||
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | ||
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 0.600.10 | ||
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 0.500.20 1.250.20 0.800.20 | ||
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 0.600.30 1.600.30 | ||
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | ||
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | ||
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | ||
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | ||
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | ||
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | ||
| 5. Specification and testing method | Temperature | -55~+125 | Naked eye (Visual inspection) / Digital calliper |
| Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) / Digital calliper | |
| Static capacity | Meet standard specification and tolerance | See detailed specification in source document | |
| Dissipation factor (DF) | See detailed specification in source document | See detailed specification in source document | |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 9. Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11. Thermal shock | See detailed specification in source document for capacity change rate, DF, and IR. | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| 12. Temperature moisture exposure | Visual: No visual damage. Capacity change rate: See detailed specification. DF: 2 times initial standard. IR: See detailed specification. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| 13. High temperature exposure | Visual: No visual damage. Capacity change rate: See detailed specification. DF: 2 X initial standard. IR: See detailed specification. | Temperature 1253, Time 100048 hours. Voltage varies based on rated voltage. Test after place 48 hours under normal pressure & temperature. | |
| 14. PCB flexural strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on the provided diagram. | |
| 6. EMBOSSED PLASTIC TAPING | Embossed tape reel packing for 0805(2012)~1812(4532) type | ||
| Dimensions (unit: mm) and specifications for various tape sizes (0805, 1206, 1210, 1808, 1812) are detailed in the source document. | |||
| Paper tape reel packing | Paper tape reel packing for 10050402~12063216 | ||
| Dimensions (unit: mm) and specifications for various paper tape sizes (1005, 0201, 0402, 0603, 0805, 1206) are detailed in the source document. | |||
| Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N for Embossed Taping. No paper dirty remains on the scotch when peeling. | ||
| Packing quantity | See detailed quantity per reel for Paper T/R and Plastic T/R in the source document, varying by size and thickness. | ||
| 9. Recommended Soldering Method | Details for various sizes (1005, 0201, 0402, 0603, 0805, 1206, 1210) and temperature characteristics (NPO, X7R/X5R/X7S/X6S, Y5V) are provided, with R indicating Reflow Soldering and W indicating Wave Soldering. | ||
| 10. The temperature profile for soldering | While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150. | ||
2509251626_AIDE-CAPACITOR-0805C0G470J631NT_C48579577.pdf
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